2019
DOI: 10.1016/j.surfcoat.2019.01.082
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A setup for arc-free reactive DC sputter deposition of Al-O-N

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Cited by 2 publications
(4 citation statements)
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“…The deposition parameters are summarized in Table 1 and detailed in the supplementary material (SM). Instabilities typically occurring in reactive sputter processes with O 2 could be avoided by our modified sputter system setup described in [10].…”
Section: Al-o-n Thin Film Preparation and Chemical Analysismentioning
confidence: 99%
“…The deposition parameters are summarized in Table 1 and detailed in the supplementary material (SM). Instabilities typically occurring in reactive sputter processes with O 2 could be avoided by our modified sputter system setup described in [10].…”
Section: Al-o-n Thin Film Preparation and Chemical Analysismentioning
confidence: 99%
“…For the DC sputter deposition of films with high O contents, a special gas flow setup was implemented in the sputter chamber to avoid oxygen poisoning of the Al targets. 3 The crystallinity of the films, in particular the c-axis lattice dimension, was investigated by symmetric XRD measurements. As described in detail in our recent work, 9 the Al-O-N films show a microstructural evolution with increasing O content that is distinguished by three distinct O concentration regimes, comparable to those found in our earlier work on the Al-Si-N system.…”
Section: Methodsmentioning
confidence: 99%
“…The O composition was determined by Rutherford backscattering and refined by elastic recoil detection analysis (RBS/ERDA). For the DC sputter deposition of films with high O contents, a special gas flow setup was implemented in the sputter chamber to avoid oxygen poisoning of the Al targets . The crystallinity of the films, in particular the c -axis lattice dimension, was investigated by symmetric XRD measurements.…”
Section: Experimental and Computational Proceduresmentioning
confidence: 99%
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