A Short Survey on Residual Stress Measurements by HDM and ESPI

Pappalettere, Carmine

doi:10.1007/978-3-319-63028-1_17

Cited by 2 publications

(1 citation statement)

References 55 publications

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“…Recently, a tendency to use the optical methods, especially Digital (Electronic) Speckle-Pattern Interferometry (DSPI, ESPI) or Digital Image Correlation (DIC) in combination with the holedrilling method can be observed [11], [12], [13]. Already at the turn of the 1960s and 1970s, the application of photoelasticity to determine stresses around drilled holes was described by Nisida [14] and Redner [15].…”

Section: Introductionmentioning

confidence: 99%

Development of the Device with a High Positioning Accuracy Serving for Residual Stress Quantification using Optical Methods

Pástor¹,

Čarák²,

Hagara³

2019

Acta Mechanica Slov.

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The paper describes some procedures required for functional verification of a newly designed unique positioning device developed to quantify residual stresses by modern optical methods with a combination of the hole-drilling method based on ASTM-E 837-13a American standard. The high precision of milling a circular groove or a hole belongs to essential requirements for achieving relevant results in the quantification of residual stresses using semidestructive methods. At the beginning of the paper, the mechanical parts of the developed drilling device are briefly described. Subsequently, two analyses were realized and present in the paper. While the first one verifies the possibilities and accuracy of the cutter positioning in the vertical direction, the second one is focused on the investigation of the milled groove circularity. The results of both analyses are processed tabularly and prove the possibility to use the drilling device in residual stress analysis.

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Section: Introductionmentioning

confidence: 99%