A silicon surface barrier microstrip detector designed for high energy physics

Heijne, E.H.M.; Hubbeling, L.; Hyams, B.; Jarron, P.; Lazeyras, P.; Piuz, F.; Vermeulen, J. C.; Wylie, A.

doi:10.1016/0029-554x(80)90812-5

Cited by 85 publications

(24 citation statements)

References 14 publications

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“…The detector itself can be segmented, with parallel processing of signals from the segments. We have shown [4] that in the case of the detection of photons and minimum ionizing particles, there is no charge loss due to the segmentation of the detector.…”

Section: Microelectronics and Segmented Detector Designmentioning

confidence: 94%

The impact of microelectronics on particle detection

Heijne

Jarron

1984

Nuclear Instruments and Methods in Physics Research Section A:

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Section: Microelectronics and Segmented Detector Designmentioning

confidence: 94%

The impact of microelectronics on particle detection

Heijne

Jarron

1984

Nuclear Instruments and Methods in Physics Research Section A:

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“…In each beam crossing in a hadron collider thousands of hits are registered all over the useful + In 1980 the author, together with Pierre Jarron [14] created at CERN the first operational silicon microstrip detector system for particle physics and tried it out for tracking and vertexing together with collaborators in the experiment NA11. These devices then proved a succesful, even essential tool to study charm and beauty flavours.…”

Section: Challenges For Tracking In Future Particle Experimentsmentioning

confidence: 99%

“…Meth. A for Proceedings of STD5 Hiroshima,[14][15][16][17] The other presentations in the HDI session were by Unno on advanced multi-layer, fine-pitch substrates [9] and by Kwiatowski on a densely packed multi-sensor imaging module with high performance circuits connected to each sensor [10]. The present introductory paper focusses in sections 3, 4 and 5 on trends in semiconductor technologies that may lead to improvements in tracking performance over the next decade.…”

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confidence: 99%

Future semiconductor detectors using advanced microelectronics with post-processing, hybridization and packaging technology

Heijne¹

2005

Nuclear Instruments and Methods in Physics Research Section A:

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Several challenges for tracking with semiconductor detectors in the high rate environment of future elementary particle physics experiments are discussed, such as reduction of spurious hits and ambiguities and identification of short-lived 'messenger' particles inside jets. To meet these requirements the instrumentation increasingly calls on progress in microelectronics. Advanced silicon integration technology for 3D packaging now offers post-processing of CMOS such as wafer thinning to 50µm and through-wafer vias of <10µm. These technologies might be applied to create new tracking detectors which can handle vertexing under the difficult rate conditions. The sensor layers can be only ~50µm thick with low noise performance and better radiation hardness by using small volume pixels. Multi-layer sensors with integrated coincidence signal processing could discriminate real tracks from various sources of background. Even in a ~400µm thick 3D assembly the vectors of tracks can be determined in ~10 degree bins and this multi-voxel device is called 'vector detector'. The measured vectors can be used to associate the main tracks to their vertices in the interaction region at high luminosity colliders and to establish an on-line, first-level trigger signature. Nucl. Instr. Meth. A for Proceedings of STD5 Hiroshima,[14][15][16][17] The other presentations in the HDI session were by Unno on advanced multi-layer, fine-pitch substrates [9] and by Kwiatowski on a densely packed multi-sensor imaging module with high performance circuits connected to each sensor [10]. The present introductory paper focusses in sections 3, 4 and 5 on trends in semiconductor technologies that may lead to improvements in tracking performance over the next decade. The challenge is the ever higher rates that are under discussion for future upgrades of the hadron colliders, as well as in the high energy, high intensity electron-positron collider CLIC. Some details will be given in section 2. A proposal for the 'vector detector' based on pixels and HDI is finally described in section 6. Submitted toWith its hundreds of millions of tracking points the central region of a collider experiment has some resemblance to the earlier workhorses of particle physics: the liquid-filled bubble chamber or the gaseous time-projection chamber, in which multi-track events could be visualized. advantage of the semiconductor hybrid assembly is the potential to individually resolve and temporarily store micrometer scale space coordinates of tracks from collider interactions that succeed each other at 40MHz rate and with thousands of tracks in each beam crossing.A comparable example of a semiconductor development with significant impact on science is the Charge Coupled Device (CCD) which finds many applications in imaging for astronomy, biology, and also in particle tracking as described in these proceedings by Damerell [11]. The CCD can offer very small (~10µm) pixel dimensions in all directions, resulting in even lower noise and better precision. The CCD vertex ...

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“…The introduction of silicon strip detectors into this field dates back to 1980 [1], whereas silicon pixel detectors appeared at the beginning of the 90's [2]. Silicon sensors have considerably improved since then, but the continuing popularity of semiconductor detectors can be accredited mainly to progress in microelectronics.…”

Section: Introductionmentioning

confidence: 99%

X-ray imaging using single photon processing with semiconductor pixel detectors

Mikulec

Campbell

Heijne

et al. 2003

Nuclear Instruments and Methods in Physics Research Section A:

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More than 10 years experience with semiconductor pixel detectors for vertex detection in high energy physics experiments together with the steady progress in CMOS technology opened the way for the development of single photon processing pixel detectors for various applications including medical X-ray imaging. The state of the art of such pixel devices consists of pixel dimensions as small as 55 × 55 µm 2 , electronic noise per pixel <100 e − rms, signal-to-noise discrimination levels around 1000 e − with a spread <50 e − and a dynamic range up to 32 bits per pixel. Moreover, the high granularity of hybrid pixel detectors makes it possible to probe inhomogeneities of the attached semiconductor sensor.

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A silicon surface barrier microstrip detector designed for high energy physics

Cited by 85 publications

References 14 publications

The impact of microelectronics on particle detection

The impact of microelectronics on particle detection

Future semiconductor detectors using advanced microelectronics with post-processing, hybridization and packaging technology

X-ray imaging using single photon processing with semiconductor pixel detectors

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