2008
DOI: 10.1002/sia.2933
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A simple erosion dynamics model of molecular sputter depth profiling

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Cited by 31 publications
(46 citation statements)
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“…In addition to the energy distribution of the sputtered flux, the build-up of sub-surface chemical damage is known to increase the amount of molecular fragmentation observed during subsequent analyses [32][33][34][35]. This result has primarily been observed under dynamic sputtering conditions, but can be replicated for pulsed analysis by increasing the primary ion duty cycle.…”
Section: Resultsmentioning
confidence: 99%
“…In addition to the energy distribution of the sputtered flux, the build-up of sub-surface chemical damage is known to increase the amount of molecular fragmentation observed during subsequent analyses [32][33][34][35]. This result has primarily been observed under dynamic sputtering conditions, but can be replicated for pulsed analysis by increasing the primary ion duty cycle.…”
Section: Resultsmentioning
confidence: 99%
“…Equation (2) describes the initial exponential decay observed SIMS depth profiles, later referred to as region I, but does not describe any further decline in signal in the steady state region (region II). This region is discussed in greater detail in more recent work by Wucher (2008). Unlike the case described in Equation (2), which assumes a constant erosion rate with increasing fluence in the steady steady state region, this modification describes the case where the erosion rate, or sputter yield (Y), changes with fluence.…”
Section: B Erosion Model For Molecular Depth Profilingmentioning
confidence: 92%
“…The sputtering yields at the interface can be measured via a quartz crystal microbalance (QCM) for example. In addition, film preparations have to be optimized, such that there are no ripples in the polymer films, and/or the raw data manipulated such that the depth profile is obtained only in common areas of the film where the thickness is consistent (Wucher, 2008;Mahoney, 2009 Taking the above notions into consideration, it can be stated that C þ 60 is an ideal source for depth profiling through thicker polymeric layers (Fisher et al, in press), as the signal tends to remain stable for much higher fluences, and has comparably higher sputtering yields. The following approximate sputtering yields were reported for PLA under varying conditions for both SF .…”
Section: Standard Methods Astm E1428-91 Uses the Following Equation; Dmentioning
confidence: 99%
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