3rd Electronics System Integration Technology Conference ESTC 2010
DOI: 10.1109/estc.2010.5642911
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A simulation-based design method to transfer surface mount RF system to flip-chip die implementation

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“…9 is the Tyndall Zigbee mote with QFN packaging [9], right of Fig. 9 is the Tyndall ADF7020 mote with flip chip packaging of the bare die [10]. The Zigbee mote was working at 2.4GHz, while the ADF7020 was at 433MHz.…”
Section: Measurements Verificationmentioning
confidence: 99%
“…9 is the Tyndall Zigbee mote with QFN packaging [9], right of Fig. 9 is the Tyndall ADF7020 mote with flip chip packaging of the bare die [10]. The Zigbee mote was working at 2.4GHz, while the ADF7020 was at 433MHz.…”
Section: Measurements Verificationmentioning
confidence: 99%