2008
DOI: 10.1063/1.2890432
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A single-layer permeation barrier for organic light-emitting displays

Abstract: Films of a hybrid material with part-SiO2 part-silicone character are deposited as environmental barriers on bottom-emitting and on transparent organic light-emitting diodes. Devices coated with this barrier have lifetimes of up to ∼7500h when stored at 65°C and 85% relative humidity, by far exceeding the industrial requirement of 1000h. The intensity of the Si–O–Si absorption at the wavenumber of 1075cm−1, the wetting angle by water, and the indentation hardness support the interpretation of a homogeneous mat… Show more

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Cited by 75 publications
(48 citation statements)
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“…For instance, the lifetime of encapsulated OLEDs with PECVD SiN x was 600 h compared to 6 h for a bare device [716]. Recently, PECVD SiO x :H films exhibited better protection of OLEDs [708]. Using an appropriate combination of HDMSO and O 2 precursors, it was possible to deposit a single composite layer consisting of SiO 2 and Si, which protected OLEDs up to 7500 h, when stored at 65°C in 85% RH.…”
Section: Recent Os Device Developmentsmentioning
confidence: 94%
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“…For instance, the lifetime of encapsulated OLEDs with PECVD SiN x was 600 h compared to 6 h for a bare device [716]. Recently, PECVD SiO x :H films exhibited better protection of OLEDs [708]. Using an appropriate combination of HDMSO and O 2 precursors, it was possible to deposit a single composite layer consisting of SiO 2 and Si, which protected OLEDs up to 7500 h, when stored at 65°C in 85% RH.…”
Section: Recent Os Device Developmentsmentioning
confidence: 94%
“…In this method, the adhesive is applied using a syringe, which may cause device damage in case the epoxy touches the semiconductor layers. Alternatively, Al-Li and high-density polyethylene (HDPE) multilayers were used with a half-life of 63 h on glass substrate [709], while elsewhere a combination of oxide, polymer, and epoxy seals [710] was employed for OLEDs on glass with a half-life of over 1000 h. Accelerated testing at 65°C and 85% relative humidity (RH) of PECVD SiO x /Si combinations on glass [708] gave a half-life of 7500 h. For devices prepared on flexible substrates, chemical vapor deposition (CVD) parylene-N/C, individually or in combination, showed four times enhanced lifetime over that of unencapsulated [711] devices. A proprietary barrier formulation on PET gave over 2000 h of half-life [712], whereas a lamination-based encapsulation of OLEDs on plastic substrate showed a half-life of 230 h [713].…”
Section: Recent Os Device Developmentsmentioning
confidence: 99%
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“…Polydimethylsiloxane (PDMS) is the most used elastomer substrate because it combines biocompatibility with suitable mechanical properties 13 . Moreover, PDMS can be easily synthesized by available laboratory techniques and it is not attacked by most process chemicals 14 . Amorphous PDMS can be synthesized in different microscopic structures, depending on the applications, including entangled-melt (EM) films (composed by a network of chains strongly wrapped around each other) as well as cross-linked (CL) structures in which individual chains are chemically bonded to each other through suitable cross-linker molecules 15 .…”
Section: Introductionmentioning
confidence: 99%
“…However, depending on the fabrication process, the extrinsic properties of inorganic oxide thin films are significantly changed by defects such as pinholes or cracks introduced during manufacture. In general, inorganic oxide thin films are fabricated on a substrate by sputtering, chemical vapor deposition (CVD), atomic layer deposition (ALD), laser ablation and sol-gel coating [15][16][17][18][19]. Furthermore, selfsupporting ultrathin films have been developed by several preparative techniques, such as solvent casting, self-assembly ABA triblock copolymer and cross-linking of Langmuir-Blodgett [20][21][22].…”
Section: Introductionmentioning
confidence: 99%