A spatiotemporal signal processing technique for wafer-scale IC thermomechanical stress monitoring by an infrared camera

Abstract

In this paper, we describe a new silicon-die thermal monitoring approach using spatiotemporal signal processing technique for Wafer-Scale IC thermomechanical stress monitoring. It is proposed in the context of a wafer-scale-based (WaferIC TM) rapid prototyping platform for electronic systems. This technique will be embedded into the structure of the WaferIC, and will be used as a preventive measure to protect the wafer from possible damages that can be caused by excessive thermomechanical stress. The paper also presents spatial and spatiotemporal algorithms and the experimental results from an IR images collection campaign conducted using an IR camera.