2013
DOI: 10.1016/j.powtec.2013.08.039
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A specific chemical activation pretreatment for electroless nickel plating on SiC ceramic powders

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Cited by 27 publications
(13 citation statements)
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“…Dense reactive place was formed, which is the major causes of severely agglomerated plated powders. Control distribution of activated sites is the most effective method for obtaining uniform distribution of plated particles 13 17 . The preparation of uniform distribution of metal particles on PA12 powders surface by electroless plating technique is still not well studied.…”
Section: Introductionmentioning
confidence: 99%
“…Dense reactive place was formed, which is the major causes of severely agglomerated plated powders. Control distribution of activated sites is the most effective method for obtaining uniform distribution of plated particles 13 17 . The preparation of uniform distribution of metal particles on PA12 powders surface by electroless plating technique is still not well studied.…”
Section: Introductionmentioning
confidence: 99%
“…In order to solve this problem, various electromagnetic wave shielding materials have been developed. Such materials include metal powders of silver, copper, nickel, cobalt, and metal alloy films, and these materials possess excellent conductivity [1][2][3][4][5]. However, the disadvantages such as high density, high cost, and poor processibility greatly restrict their practical use for shielding materials.…”
Section: Introductionmentioning
confidence: 99%
“…Nevertheless, most of the time, works have investigated coatings on graphite particles of graphite fibers in an alkaline bath [23] or containing specific chemical agents [24]. Chemical activation pretreatment of powder has also proven to be successful in improving the wettability and the activity of graphite [25,26], as well as the electrochemical deposition of Ni on carbon microfiber surfaces using unbuffered NiCl 2 [27].…”
mentioning
confidence: 99%