Abstract:Chemical mechanical polishing (CMP) greatly benefits from the wafer and pad’s microscale contact condition. With so many varying pressures and wafer layouts, it is incredibly difficult to measure all the microscale contact states. Therefore, there is an urgent need to realistically characterize the morphology and contact state of polishing pads. A statistical characterization model of the microscale contact state of polishing pads was developed in this investigation. The microscale contact states under differe… Show more
Set email alert for when this publication receives citations?
scite is a Brooklyn-based organization that helps researchers better discover and understand research articles through Smart Citations–citations that display the context of the citation and describe whether the article provides supporting or contrasting evidence. scite is used by students and researchers from around the world and is funded in part by the National Science Foundation and the National Institute on Drug Abuse of the National Institutes of Health.