A study by Raman, near-infrared and dynamic-mechanical spectroscopies on the curing behaviour, molecular structure and viscoelastic properties of epoxy/anhydride networks

Musto, Pellegrino; Abbate, Mario; Ragosta, G.; Scarinzi, Gennaro

doi:10.1016/j.polymer.2007.04.042

Cited by 85 publications

(64 citation statements)

References 27 publications

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“…The peak at 1609 cm -1 is attributed to the aromatic ring (quadrant stretching) present in the epoxy monomer. In the literature, this peak has been reported at 1614 cm -1 [10,[23][24][25]. It is worth mentioning that there is a small shift of this peak compared with the results obtained from pure epoxy (see Figure 1), in which the peak is located at 1612 cm -1 .…”

Section: Composite Dgeba + Hy 918 + 30% Cumentioning

confidence: 51%

“…This could be evidence of the formation of some organic complex at the matrix-particle interface. On the other hand, the peak at 1113 cm -1 is clearly evident in the spectrum taken at position N°6 and could be attributed to the vibration of ether groups, C-O-C [9,28], while the peak at 1186 cm -1 can be associated to the in-plane deformation of the aromatic ring [23]. The peaks at 1230 and 1253 cm -1 diminish in intensity in a complex way as the curing progresses, and in particular, the peak at 1253 cm -1 can be attributed to the epoxy ring [23].…”

Section: Composite Dgeba + Hy 918 + 30% Cumentioning

confidence: 97%

“…The peak at 1457 cm -1 can be attributed to the matrix, and to be specific, it can be interpreted as two superposed peaks located at 1445 and 1460 cm -1 . Rocks et al [10] attributed these peaks to the vibra- [23] reported a peak at 1447 cm -1 belonging to the anhydride that is invariant during the curing. The peak at 1300 cm -1 could be, according to Kister et al [27], the superposition of three peaks located at 1313, 1302 and 1293 cm -1 and associated with the vibration $ 2 CH.…”

Section: Composite Dgeba + Hy 918 + 30% Cumentioning

confidence: 99%

See 2 more Smart Citations

A micro-Raman study of Cu-particulate-filled epoxy matrix composites

Tognana¹,

Salgueiro²,

Valcarce³

2014

Express Polym. Lett.

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Epoxy resins are used in structural applications ranging from high-performance composites for aerospace applications to encapsulants for the microelectronics industry because of their high thermal resistance, high tensile strength and modulus, and good chemical resistance. It is well known that the most important factors that influence their performance are the molecular architecture, the ratio between the epoxide and the hardener, and the cure conditions, frequently at a high temperature, which determine the final properties of the material. The influence of the filler particles on the curing is still a subject of study and clearly depends on the nature of the particles [1][2][3][4][5]. Epoxy matrix composites find new applications every day in several areas of engineering and technology. For example, copper-filled composites have a high possibility of being used in microelectronics because the high thermal conductivity of copper allows the composite to be a good heat dissipator, which serves as protection to electronic devices [6,7]. The matrix-particle interphases also play an important role. The physical properties of the polymeric composites can be significantly influenced by their thermal history; in fact, internal stresses are developed during the fabrication process and further thermal treatments. Abstract. A micro-Raman study is carried out to investigate the influence of the filler on the curing process of bisphenol A diglycidyl ether (DGEBA)-based epoxy matrix composites. The composites are cured (14 h at 393 K) with an anhydride (methyl tetrahydro phthalic anhydride, MTHPA, 100:90 pbw), catalyzed with a tertiary amine (0.7 pbw) and filled with a 30% volume of Cu particles of approximately 75 !m in diameter. The experimental results are compared with those obtained for the same epoxy resin unfilled and for the same composite with Cu filler but not catalyzed. The micro-Raman experimental technique is used to search for information on the curing process in different regions of the matrix, near to and far from the copper filler, taking into account the results of differential-scanning-calorimetry measurements performed on the same composites. The results provide information on the influence of the copper filler on the curing process of the epoxy matrix. Differences were observed in the peaks associated with the epoxy ring and the ester group as a function of the distance to the nearest copper particle, but no differences were observed between the different composites.

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Section: Composite Dgeba + Hy 918 + 30% Cumentioning

confidence: 51%

Section: Composite Dgeba + Hy 918 + 30% Cumentioning

confidence: 97%

Section: Composite Dgeba + Hy 918 + 30% Cumentioning

confidence: 99%

See 1 more Smart Citation

A micro-Raman study of Cu-particulate-filled epoxy matrix composites

Tognana¹,

Salgueiro²,

Valcarce³

2014

Express Polym. Lett.

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“…(2) However, acid anhydrides are hygroscopic materials and tend to pick up atmospheric moisture. They should not be allowed to remain exposed to air for extended periods.…”

mentioning

confidence: 99%

“…Anhydride cure epoxies takes two hours or even more time to cure at high temperatures. (2) In the very competitive electronic industry, faster cycle time is continuously sought after to increase productivity and lower costs of production.…”

mentioning

confidence: 99%

UV-curable Encapsulants for LED

Beng¹

2012

Orientjchem.

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UV cured epoxy systems represent complementary technology to the established heat cured epoxy systems for coating, adhesion and encapsulation of electronic devices. The UV cured epoxy systems offer significant benefits in terms of fast cure and thus very short production cycle time; low stress and better colour due to room temperature cure; process wise no mix ratio problem or anhydride handling issues and yet produce comparable or even better physical and chemical property than the more common heat cured systems. This paper deals with the evaluation and comparison among four different type of curing systems for LED encapsulants: 1.Free radical UV system with faster curing rate but only surface layer cure. 2.Cationic UV system with slower curing rate but deeper layer cure. 3.Hybrid of both free radical and cationic UV system. 4.Existing heat cure system. Characterisation topics included the state-of-the-art LED package strength indicated by DMA modulus, TMA coefficient of thermal expansion, photostress, liquid nitrogen and ring washer crack test; outdoor performance indicated by heat age at 120 o C, 180 o C, atmospheric moisture absorption and boiling water absorption; solder heat resistance indicated by Tg, % cure and solder (TTW) delamination and last but not least the optical clarity indicated by % Transmission under UV-visible range and the refractive index.

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Raman Spectroscopy

Leader

2010

Process Analytical Technology

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A study by Raman, near-infrared and dynamic-mechanical spectroscopies on the curing behaviour, molecular structure and viscoelastic properties of epoxy/anhydride networks

Cited by 85 publications

References 27 publications

A micro-Raman study of Cu-particulate-filled epoxy matrix composites

A micro-Raman study of Cu-particulate-filled epoxy matrix composites

UV-curable Encapsulants for LED

Raman Spectroscopy

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