2010 IEEE International Conference on Semiconductor Electronics (ICSE2010) 2010
DOI: 10.1109/smelec.2010.5549356
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A study for optimum productivity yield in 0.16µm mixed of wafer fabrication facility

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“…Process to fabricate a chip on a wafer required 300 to 1000 steps process re-entrance to similar equipment more than 30% of the total steps, cycle time can be up to 90 days depends to complexity and priority given for a product with minimum of 60 equipment. Notice the ratio between number of steps and equipment is almost 5 times, which is due to the wafer fabrication process is not like a single line assembly process in normal factory instead of re-entrance back to the same process [2] [3]. Fig.…”
Section: Introductionmentioning
confidence: 99%
“…Process to fabricate a chip on a wafer required 300 to 1000 steps process re-entrance to similar equipment more than 30% of the total steps, cycle time can be up to 90 days depends to complexity and priority given for a product with minimum of 60 equipment. Notice the ratio between number of steps and equipment is almost 5 times, which is due to the wafer fabrication process is not like a single line assembly process in normal factory instead of re-entrance back to the same process [2] [3]. Fig.…”
Section: Introductionmentioning
confidence: 99%