A study of atmospheric-pressure CHF3/Ar plasma treatment on dielectric characteristics of polyimide films

Park, Soo‐Jin; Lee, Eunjung; Kim, Byung-Joo

doi:10.1016/j.jcis.2007.08.003

Cited by 19 publications

(9 citation statements)

References 10 publications

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“…We have observed small decrease (∼ 2%) in dielectric constant of the films with increasing frequency. This is in good agreement with other works 19, 26. For polar polymers the dielectric constant increases with increasing temperature.…”

Section: Resultssupporting

confidence: 93%

The effect of titania content on the physical properties of polyimide/titania nanohybrid films

Kizilkaya

Dumludağ

Karataş

et al. 2012

J of Applied Polymer Sci

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In this study, a series of PI/TiO 2 nanohybrid materials were prepared from polyamic acid of 3,3 0 ,4,4 0 -benzophenonetetracarboxylic dianhydride/3,3 0diaminodiphenyl sulfone, and titania precursor by the sol-gel method. The titania content in the hybrid system was varied from 0 to 5 wt %. The physical and mechanical properties of the hybrids such as refractive index, optical transmission, and tensile strength were investigated. It was determined that incorporation of titania precursor into the PI matrix improved the refractive indices and tensile modulus of the hybrid films. It was observed that the optical transmittance and tensile strength of the nanohybrids were slightly decreased with the increasing titania content. It was determined that the hybrid films might have enhanced the UV shielding properties compare to the PI films. Furhermore, the hybrid materials showed better thermal stability than the PI. SEM studies demonstrated that titania particles (1 and 3 wt %) were distributed homogeneously through the PI matrix. The effect of the titania content in the PI on DC conductivity and dielectric constant were also analyzed. For the PI film containing 5 wt % titania, activation energy value increased to 1.0 eV from the value of 0.65 eV. DC conductivity value of the films depending on titania content varied between 3.0 Â 10 À11 and 1.4 Â 10 À10 S/cm at room temperature. Relative dielectric constants of the films were calculated from capacitance measurements depending on frequency (40-100 kHz) at different temperatures (303-360 K). The values increased with the increasing titania content.

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Section: Resultssupporting

confidence: 93%

The effect of titania content on the physical properties of polyimide/titania nanohybrid films

Kizilkaya

Dumludağ

Karataş

et al. 2012

J of Applied Polymer Sci

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“…Films are cast, and then they are thermally dehydrated to produce the final imide form (11). They are distinguished from other highperformance polymers by the solubility of their poly (amic acid) precursor form, which can be cast into uniform films and quantitatively converted to polyimide (12). Multifarious types of polyimides which are used for adhesives, including polycondensation PI, thermoplastic PI, siloxaneblock co-polyimide, polyamide-imide, norbornene anhydride and its monoester capped PI, acetylene capped PI and BMI, and so forth.…”

Section: Introductionmentioning

confidence: 99%

Synthesis and Characterization of a Novel High-Temperature Structural Adhesive Based on MDA-BAPP-BTDA Co-Polyimide

Yang

et al. 2015

Journal of Macromolecular Science, Part A

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A series of polyimide(PI) adhesives were synthesized from 2,2'-Bis [4-(4-aminophenoxy)phenyl] propane(BAPP), 4,4'-Diaminodiphenylmethane (MDA) and 3,3',4,4'-Benzophenonetetracarboxylic acid dianhydride (BTDA) via a two-step process. PI adhesives with different BAPP content were characterized in regard to their structure, thermal stability, mechanical properties and adhesive performance. Results showed that these PIs had excellent thermal stability, whose glass transition temperature (Tg) were around 300 C. While, superior dynamic mechanical behavior was observed, and the maximum loss factor declined with the increase of BAPP content. Single-lap shear strength of over 15.58 MPa at room temperature was obtained, and it remained high even at the temperature of 350 C. Factors that could affect bonding strength of these PI adhesives such as molar ratio of the diamine monomers, surface roughness of adherends and curing processes were investigated.

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“…Measurements of the dielectric constant at 1 MHz showed that at 25°C its value gradually decreases depending on the power from 3.15 for the initial film to 2.45 for the film treated at 400 W. There was also an increase in ε' by 0. studies with varying the frequency in the range of 100 to 10 7 Hz and the temperature in the range of 0-200°С at a frequency of 10 3 Hz showed that ε' is reduced (within 5%) by increasing frequency and increases at a constant frequency with an increase in the temperature [17].…”

mentioning

confidence: 97%

“…However, studies of this sort were carried out for other polymers, such as Kapton H [16,17], fluori nated poly(arylene oxide) and a divinylsiloxane-ben zocyclobutane copolymer [18], and Parylene C [19].…”

mentioning

confidence: 99%

Dielectric properties of polytetrafluoroethylene films modified by direct current discharge

et al. 2014

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Dielectric characteristics of polytetrafluoroethylene (PTFE) films modified by direct current dis charge at the anode and cathode have been studied as a function of frequency and temperature. It has been found that the dielectric constant increases slightly as a result of plasma treatment and weakly depends on temperature. It has been shown that the frequency dependences of conductivity at 20°C differ somewhat for the original and treated films, but the closer resemble one another at 80°C, with the difference in the critical conductivity indices becoming more significant.

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A study of atmospheric-pressure CHF3/Ar plasma treatment on dielectric characteristics of polyimide films

Cited by 19 publications

References 10 publications

The effect of titania content on the physical properties of polyimide/titania nanohybrid films

The effect of titania content on the physical properties of polyimide/titania nanohybrid films

Synthesis and Characterization of a Novel High-Temperature Structural Adhesive Based on MDA-BAPP-BTDA Co-Polyimide

Dielectric properties of polytetrafluoroethylene films modified by direct current discharge

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