A study of considering the reliability issues on ASIC/Memory integration by SIP (System-in-Package) technology

Song, Yoo Sung; Kim, S.G.; Lee, S.B.; Rhee, K.J.; Kim, Tae Seon

doi:10.1016/s0026-2714(03)00251-8

Cited by 8 publications

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“…One of the crit-582 H. XU ET AL. ical issues in advanced microelectronic packaging is to develop high-density multilayer packaging substrates [1,2]. Currently, the conventional packaging substrates are usually produced based on the E-glass cloth-reinforced polymer matrix composite laminates as the substrate core, in which the E-glass cloths are employed as the reinforcing materials due to their outstanding electrical insulation and dielectric properties, good mechanical strength and modulus etc., and the polymer resins are used as the composite matrices.…”

Section: Introductionmentioning

confidence: 99%

Preparation and Properties of Glass Cloth-reinforced Meltable Thermoplastic Polyimide Composites for Microelectronic Packaging Substrates

Tao

Liu

et al. 2010

High Performance Polymers

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Meltable thermoplastic polyimide resins (MTPI) with designed polymer backbones and controlled molecular weights for advanced microelectronic packaging substrate application have been synthesized by thermal polycondensation of aromatic dianhydride and aromatic diamine in presence of endcapping agent. The thermoplastic polyimide resins could be dissolved in organic solvents to give low viscosity solutions, which were then employed to impregnate E-glass cloth (EG) to yield MTPI/EG prepregs. After removal of the organic volatile, the MTPI/EG prepregs were plied up and then melt processed to give MTPI/EG composite laminates with high quality. Experimental results demonstrated that the MTPI/EG composite laminates showed desirable characteristics, including: (1) excellent thermal stability1 (2) good mechanical properties1 (3) great electrical insulating and dielectric properties1 as well as (4) high peel strength between copper foil and the composite surface.

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Section: Introductionmentioning

confidence: 99%

Preparation and Properties of Glass Cloth-reinforced Meltable Thermoplastic Polyimide Composites for Microelectronic Packaging Substrates

Tao

Liu

et al. 2010

High Performance Polymers

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Preparation and properties of glass cloth‐reinforced polyimide composites with improved impact toughness for microelectronics packaging substrates

Tao

Fan

et al. 2010

J of Applied Polymer Sci

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A series of glass cloth-reinforced thermosetting polyimide composites (EG/HTPI) were prepared from E-glass cloth (EG) and polyimide matrix resins. The polyimide resins were derived from 1,4-bis(4-amino-2-trifluoromethyl-phenoxy)benzene, p-phenylenediamine, diethyl ester of 3,3 0 ,4,4 0 -benzophenonetetracarboxylic acid, and monoethyl ester of cis-5-norbornene-endo-2,3-dicarboxylic acid. Based on the rheological properties of the Bstaged polyimide resins, the optimized molding cycles were designed to fabricate the EG/HTPI laminates and the copper-clad laminates (Cu/EG/HTPI). Experimental results indicated that the EG/HTPI composites exhibited high thermal stability and outstanding mechanical properties. They had flexural strength of >534 MPa, flexural modulus of >20.0 GPa, and impact toughness of >46.9 kJ/ m 2 . The EG/HTPI composites also showed good electrical and dielectric properties. Moreover, the EG/HTPI laminates exhibited peel strength of $ 1.2 N/mm and great isothermal stability at 288 C for 60 min, showing good potential for application in high density packaging substrates.

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Super Engineering Plastics and Forms

Shen

2018

Advanced Polyimide Materials

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A study of considering the reliability issues on ASIC/Memory integration by SIP (System-in-Package) technology

Cited by 8 publications

References 0 publications

Preparation and Properties of Glass Cloth-reinforced Meltable Thermoplastic Polyimide Composites for Microelectronic Packaging Substrates

Preparation and Properties of Glass Cloth-reinforced Meltable Thermoplastic Polyimide Composites for Microelectronic Packaging Substrates

Preparation and properties of glass cloth‐reinforced polyimide composites with improved impact toughness for microelectronics packaging substrates

Super Engineering Plastics and Forms

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