2014
DOI: 10.15407/dopovidi2014.09.086
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A study of electrodeposited thin tin films in cycling in aprotic solvents

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(2 citation statements)
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“…Various ways to improve the adhesion between a copper current lead and a tin deposit have been suggested in order to eliminate these shortcomings [5][6][7][8][9][10][11].…”
mentioning
confidence: 99%
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“…Various ways to improve the adhesion between a copper current lead and a tin deposit have been suggested in order to eliminate these shortcomings [5][6][7][8][9][10][11].…”
mentioning
confidence: 99%
“…In modern electroplating, citrate [16,17], citratestannate [18], and tartrate-trilonate [11] electrolytes are widely used to obtain functional coatings with tin and its alloys. In these electrolytes, tin(II) ions exist in the form of various complex compounds, which predetermines the mechanism of the deposition process and the morphology of the deposits obtained.…”
mentioning
confidence: 99%