A Study of Encapsulation Resin Containing Hexagonal Boron Nitride (hBN) as Inorganic Filler

Chiang, Tzu Hsuan; Hsieh, Tsung−Eong

doi:10.1007/s10904-006-9037-8

Cited by 54 publications

(30 citation statements)

References 21 publications

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“…For the sample with 40 wt% of BN (26.0 vol%) the thermal conductivity reaches 1.04 W/m·K, implying an increase of >800%. Chiang and Hsieh obtained similar values of thermal conductivity by using a cycloaliphatic‐anhydride system with 25.7 vol% of BN as filler . In addition, a larger increase is observed once percolation is reached.…”

Section: Resultsmentioning

confidence: 76%

“…The addition of thermal conductive but electrically insulating fillers to the resin is one of the easiest methods for effectively dissipating heat in such devices at the lowest price. In last years, many efforts and studies have been intended to increase the thermal conductivity of these resins, emphasizing the great importance of this subject …”

Section: Introductionmentioning

confidence: 99%

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New epoxy composite thermosets with enhanced thermal conductivity and high T_g obtained by cationic homopolymerization

et al. 2018

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Thermal dissipation is a critical aspect for the performance and lifetime of electronic devices. In this work, novel composites based on a cycloaliphatic epoxy matrix and BN fillers, obtained by cationic curing of mixtures of 3,4‐epoxy cyclohexylmethyl 3,4‐epoxy cyclohexane carboxylate (ECC) with several amounts of hexagonal boron nitride (BN) were prepared and characterized. As cationic initiator a commercial benzylanilinium salt was used, which by addition of triethanolamine, exhibited an excellent latent character and storage stability. The effect of the formulation composition was studied by calorimetry and rheological measurements. The variation of thermal conductivity, thermal stability, thermal expansion coefficient, and thermomechanical and mechanical properties of the composites with the load of BN filler (ranging from 10 to 40 wt%) was evaluated. An improvement of an 800% (1.04 W/m·K) in thermal conductivity was reached in materials with glass transition temperatures >200°C without any loss in electrical insulation. POLYM. COMPOS., 39:E1760–E1769, 2018. © 2018 Society of Plastics Engineers

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Section: Resultsmentioning

confidence: 76%

Section: Introductionmentioning

confidence: 99%

New epoxy composite thermosets with enhanced thermal conductivity and high T_g obtained by cationic homopolymerization

et al. 2018

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“…Nanocomposite coatings consisting of hexagonal and cubic boron nitride phases have been successfully deposited by reactive radio frequency magnetron sputtering to reduce stress of films 8. Chiang et al encapsulated h ‐BN as an inorganic filler in resin to decrease the coefficient of thermal expansion and enhance thermal conductivity 9. When inorganic h ‐BN is used in composite nanomaterials, a good dispersion of nanoparticles is indispensable, because the nanoparticles tend to agglomerate in various solvents.…”

Section: Introductionmentioning

confidence: 99%

Synthesis of Water‐Dispersible Boron Nitride Nanoparticles

Xiong

2014

Eur J Inorg Chem

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Spherical boron nitride nanoparticles with good aqueous dispersibility were synthesized by means of a direct reaction of boric acid and ammonium chloride. The X‐ray powder diffraction pattern confirmed the hexagonal BN structure (h‐BN) with d002 = 3.33 Å. Copper oxide (CuO) was found to affect the morphology and surface properties of the BN nanoparticles. The average size of the spherical h‐BN nanoparticles synthesized with the addition of CuO was about 30 nm. The h‐BN had a high surface area of 75 m2 g–1 and a mesoporous volume of 0.32 cm3 g–1. The presence of CuO during the synthesis could enhance the surface electronegativity of the h‐BN nanoparticles and change their isoelectric point to pH = 2.7. The zeta potentials of BN were between –30 and –50 mV in the pH range of 4–10. The h‐BN nanoparticles were well dispersed and stable in aqueous solution.

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“…Therefore, it is expected to develop composites with high thermal conductivity, low CTE, and low dielectric loss, but few investigations focus on the effect of hBN on the CTE and dielectric properties. In fact, hBN were added to epoxy resin, rubber, or styrene–ethylene–butylene–styrene polymer/poly(ethylene‐co‐vinyl acetate) blends to improve the thermal conductivity; however, it was found that the effect of hBN on the thermal conductivity is not only dependent on the content of hBN in the composites but also greatly related to the nature of polymers and the interface. For example, Hsieh's group found that, with the addition of hBN to epoxy resin, the thermal conductivity increases rapidly with a small content of hBN (<12 vol%) and ascends slowly with a large content of hBN (>12 vol%), although this result is opposite with Qi's report …”

Section: Introductionmentioning

confidence: 99%

“…In fact, hBN were added to epoxy resin, [19] rubber, [4] or styrene-ethylene-butylene-styrene polymer/poly (ethylene-co-vinyl acetate) blends to improve the thermal conductivity [20] ; however, it was found that the effect of hBN on the thermal conductivity is not only dependent on the content of hBN in the composites but also greatly related to the nature of polymers and the interface. For example, Hsieh's group found that, with the addition of hBN to epoxy resin, the thermal conductivity increases rapidly with a small content of hBN (<12 vol%) and ascends slowly with a large content of hBN (>12 vol%), [19] although this result is opposite with Qi's report. [4] This paper presents the first report on the preparation of hBN/ BDM/BDA composites and on the effect of hBN content on the thermal conductivity, CTE, and dielectric properties of the composites.…”

Section: Introductionmentioning

confidence: 99%

High‐performance hexagonal boron nitride/bismaleimide composites with high thermal conductivity, low coefficient of thermal expansion, and low dielectric loss

Gao

Jiao

et al. 2011

Polymers for Advanced Techs

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High‐performance insulating materials have been increasingly demanded by many cutting‐edge fields. A new kind of high‐performance composites with high thermal conductivity, low coefficient of thermal expansion (CTE), and low dielectric loss was successfully developed, consisting of hexagonal boron nitride (hBN) and 2,2′‐diallylbisphenol A (DBA)‐modified 4,4′‐bismaleimidodiphenylmethane (BDM) resin. The effects of hBN and its content on the integrated properties, including curing behavior of uncured system, the CTE, thermal conductivity, dielectric properties, and thermal resistance of cured composites, are systematically investigated and discussed. Results show that there are amino groups on the surface of hBN, which supply desirable interfacial adhesion between hBN and BDM/DBA resin and a good dispersion of hBN in the resin. With the increase of the hBN content, the thermal conductivity increases linearly, whereas the CTE value decreases linearly; in addition, dielectric loss gradually decreases and becomes more stable over the whole frequency from 10 to 109 Hz. In the case of the composite with 35 wt% hBN, its thermal conductivity, CTE in glassy state, and dielectric loss are about 3.3, 0.63, and 0.5 times of the corresponding value of BDM/DBA resin, respectively. These attractive integrated properties suggest that hBN/BDM/DBA composites are high‐performance insulating materials, which show great potential in applications, especially for electronics and aerospace industries. Copyright © 2011 John Wiley & Sons, Ltd.

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A Study of Encapsulation Resin Containing Hexagonal Boron Nitride (hBN) as Inorganic Filler

Cited by 54 publications

References 21 publications

New epoxy composite thermosets with enhanced thermal conductivity and high T_g obtained by cationic homopolymerization

New epoxy composite thermosets with enhanced thermal conductivity and high T_g obtained by cationic homopolymerization

Synthesis of Water‐Dispersible Boron Nitride Nanoparticles

High‐performance hexagonal boron nitride/bismaleimide composites with high thermal conductivity, low coefficient of thermal expansion, and low dielectric loss

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A Study of Encapsulation Resin Containing Hexagonal Boron Nitride (hBN) as Inorganic Filler

Cited by 54 publications

References 21 publications

New epoxy composite thermosets with enhanced thermal conductivity and high Tg obtained by cationic homopolymerization

New epoxy composite thermosets with enhanced thermal conductivity and high Tg obtained by cationic homopolymerization

Synthesis of Water‐Dispersible Boron Nitride Nanoparticles

High‐performance hexagonal boron nitride/bismaleimide composites with high thermal conductivity, low coefficient of thermal expansion, and low dielectric loss

Contact Info

Product

Resources

About

New epoxy composite thermosets with enhanced thermal conductivity and high T_g obtained by cationic homopolymerization

New epoxy composite thermosets with enhanced thermal conductivity and high T_g obtained by cationic homopolymerization