Abstract:The main objective of this study was to establish which of the many dicing tapes used in the semiconductor industry, would be most suitable for use in plasma dicing. Tape design over the past 40 years has continually evolved through advancements in both dicing technologies and the incessant revision of integrated circuit packaging. Die singulation has traditionally been accomplished using a diamond saw, laser-based technology or combinations of both. The stress on dicing tape was therefore limited to fatigue t… Show more
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