“…Moreover, low TECs of CNT/Cu nanocomposites are favorable for reducing the strains caused by the TEC mismatch between electronic devices [ 10 , 11 ]. It is worth mentioning that the high performance of CNT/Cu nanocomposites is attributed to homogeneous distribution, improved interfacial reaction, and enhanced structural integrity of CNTs in copper matrix [ 12 , 13 ]. Therefore, many fabrication technologies have been developed to address these issues, such as molecular-level mixing [ 14 , 15 , 16 , 17 ], high-energy ball milling [ 18 , 19 ], electrochemical co-deposition [ 20 ], and spark plasma sintering [ 21 ].…”