A study of SnAgCu solder paste transfer efficiency and effects of optimal reflow profile on solder deposits

Amalu, Emeka H.; Lau, Wai Kin; Ekere, N.N.; Bhatti, Raj; Mallik, Sabuj; Otiaba, Kenny C.; Takyi, G.

doi:10.1016/j.mee.2011.02.104

Cited by 26 publications

(10 citation statements)

References 13 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Several researches have investigated the effect of intermetallic compound (IMC) layer on solder joint reliability (Amalu et al, 2011;Ekere, 2012a, 2012b;George, 2010;Nadimpalli and Spelt, 2011;Xiao et al, 2013). Amalu and Ekere, (2012a), in their prediction of damage and fatigue life of high-temperature flip chip assembly interconnections at operations, utillised 3D flip chip models simulated in ANSYS 13 to investgate the damage of bonded materials.…”

Section: Effect Of Cycle Number On Determination Of Accurate Degradatmentioning

confidence: 99%

Effect of operating temperature on degradation of solder joints in crystalline silicon photovoltaic modules for improved reliability in hot climates

et al. 2018

Self Cite

View full text Add to dashboard Cite

Accelerated degradation of solder joint interconnections in crystalline silicon photovoltaic (c-Si PV) modules drives the high failure rate of the system operating in elevated temperatures. The phenomenon challenges the thermo-mechanical reliability of the system for hot climatic operations. This study investigates the degradation of solder interconnections in c-Si PV modules for cell temperature rise from 25°C STC in steps of 1°C to 120°C. The degradation is measured using accumulated creep strain energy density (). Generated magnitudes are utilised to predict the fatigue life of the module for ambient temperatures ranging from European to hot climates. The ANSYS mechanical package coupled with the IEC 61215 standard accelerated thermal cycle (ATC) profile is employed in the simulation. The Garofalo creep model is used to model the degradation response of solder while other module component materials are simulated with appropriate material models. Solder degradation is found to increase with every 1°C cell temperature rise from the STC. Three distinct degradation rates in Pa/°C are observed. Region 1, 25 to 42°C, is characterised by degradation rate increasing quadratically from 1.53 to 10.03 Pa/°C. The degradation rate in region 2 ,43 to 63 °C, is critical with highest constant magnitude of 12.06 Pa/°C. Region 3, 64 to 120°C, demonstrates lowest degradation rate of logarithmic nature with magnitude 5.47 at the beginning of the region and 2.25 Pa/°C at the end of the region. The module fatigue life, L (in years) is found to decay according to the power function = 721.48 −1.343. The model predicts module life in London and hot climate to be 18.5 and 9 years, respectively. The findings inform on the degradation of c-Si PV module solder interconnections in different operating ambient temperatures and advise on its operational reliability for improved thermo-mechanical design for hot climatic operations.

show abstract

Section: Effect Of Cycle Number On Determination Of Accurate Degradatmentioning

confidence: 99%

Effect of operating temperature on degradation of solder joints in crystalline silicon photovoltaic modules for improved reliability in hot climates

et al. 2018

Self Cite

View full text Add to dashboard Cite

show abstract

“…Solder paste printing is commonly used for attaching surface mount device to printed circuit boards (PCBs). It has been reported that a majority of the problems associated with PCB assembly can be traced back to the solder paste printing process (Ladani et al , 2008; Amalu et al , 2011; Wang, 2013; Huang et al , 2016). It is also recognized that the solder paste printing process has a dramatic impact on the productivity and quality of surface mount assembly line (Sriperumbudur et al , 2017).…”

Section: Introductionmentioning

confidence: 99%

A method for optimizing stencil cleaning time in solder paste printing process

Cao

et al. 2019

SSMT

View full text Add to dashboard Cite

Purpose Stencil cleaning is an important operation in solder paste printing process. Frequent cleaning may interrupt printing process and increase idle time, as well as loss for performing cleaning. This paper aims to propose a method to optimize the stencil cleaning time and reduce unnecessary cleaning operations and losses. Design/methodology/approach This paper uses a discrete-time, discrete-state homogeneous Markov chain to model the stencil printing performance degradation process, and the quality loss during the stencil printing process is estimated based on this degradation model. A stencil cleaning decision model based on renewal reward theorem is established, and the optimal cleaning time is obtained through a balance between quality loss and the loss on idle time. Findings A stencil cleaning decision model for solder paste printing is established, and numerical simulation results show that there exists an optimal stencil cleaning time which minimizes the long-term loss. Originality/value Stencil cleaning control is very important for solder paste printing. However, there are very few studies focusing on stencil cleaning control. This research contributes to developing a model to optimize the stencil cleaning time in solder paste printing process.

show abstract

“…Sn-based solders are the most used solders in the electronic industry for surface mount technology and similar applications [1][2][3]. However, industrial production often requires also joining parts made of different material combinations such as ceramics/metal [4][5][6].…”

Section: Introductionmentioning

confidence: 99%

Study of Direct Bonding Ceramics with Metal Using Sn2La Solder

Koleňák

Kostolný

2015

Advances in Materials Science and Engineering

View full text Add to dashboard Cite

The aim of this research was to study the direct bonding of ceramic materials, mainly Al2O3and selected metals, with primary attention given to Cu substrate. Soldering was performed with Sn-based solder alloyed with 2% La. We found that the bond formation between Sn2La solder and Al2O3occurs at the activation of lanthanum phases in solder by ultrasound. Lanthanum in the solder becomes oxidised in air during the soldering process. However, due to ultrasonic activation, the lanthanum particles are distributed to the boundary with ceramic material. A uniformly thin layer containing La, 1.5 µm in thickness, is formed on the boundary with Al2O3material, ensuring both wetting and joint formation. The shear strength with Al2O3ceramics is 7.5 MPa. Increased strength to 13.5 MPa was observed with SiC ceramics.

show abstract

A study of SnAgCu solder paste transfer efficiency and effects of optimal reflow profile on solder deposits

Cited by 26 publications

References 13 publications

Effect of operating temperature on degradation of solder joints in crystalline silicon photovoltaic modules for improved reliability in hot climates

Effect of operating temperature on degradation of solder joints in crystalline silicon photovoltaic modules for improved reliability in hot climates

A method for optimizing stencil cleaning time in solder paste printing process

Study of Direct Bonding Ceramics with Metal Using Sn2La Solder

Contact Info

Product

Resources

About