A study of surface diffusion on gold with an atomic force microscope

Göbel, H.; Blanckenhagen, P. von

doi:10.1016/0039-6028(95)00206-5

Cited by 66 publications

(40 citation statements)

References 15 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Reported values vary from 10 −20 cm 2 /s to 10 −14 cm 2 /s at room temperature. 25–29 The work of Surrey et al 25 is particularly interesting since the diffusion coefficient was calculated by aberration-corrected TEM observations of Au NPs below 10 nm; their result was a diffusion coefficient between 10 −17 and 10 −16 cm 2 /s, which is close to our results. It is important to notice that a small change in temperature will not cause a dramatic change in the surface diffusion coefficient.…”

supporting

confidence: 89%

Direct observation of liquid-like behavior of a single Au grain boundary

et al. 2013

View full text Add to dashboard Cite

Behavior of matter at the nanoscale differs from that of the bulk due to confinement and surface effects. Here, we report a direct observation of liquid-like behavior of a single grain boundary formed by cold-welding Au nanoparticles, 40 nm in size, by mechanical manipulation in-situ TEM. The grain boundary rotates almost freely due to the free surfaces and can rotate about 90 degrees. The grain boundary sustains more stress than the bulk, confirming a strong bonding between the nanoparticles. Moreover, this technique allows the measurement of the surface diffusion coefficient from experimental observations, which we compute for the Au nanoparticles. This methodology can be used for any metal, oxide, semiconductor or combination of them.

show abstract

supporting

confidence: 89%

Direct observation of liquid-like behavior of a single Au grain boundary

et al. 2013

View full text Add to dashboard Cite

show abstract

“…7, gives exponential factors close to the expected 'ideal' Arrhenius relationship of the activation energy of Au (ε a = 6.41x10 −20 J) divided by the Boltzmann constant (k B = 1.38x10 −23 J/K), or 4644.92 K [ Fig. 8(b)] [24]. Other optical techniques, such as extinction spectroscopy, have been successfully employed to measure nanostructural changes in np-Au disks [25].…”

Section: Validating Calculated Characteristic Feature Size and Timementioning

confidence: 71%

“…7(a)], this distribution can then be used to calculate the diffusion coefficient increase due to laser irradiation [ Fig. 7(b)] via the Arrhenius relationship for Au surface diffusion [24]. Using the area fractions for each different nanostructure region (shown in Fig.…”

Section: Validating Calculated Characteristic Feature Size and Timementioning

confidence: 99%

Utilizing dynamic laser speckle to probe nanoscale morphology evolution in nanoporous gold thin films

Ly¹,

Şeker²,

Matthews³

2016

Opt. Express

View full text Add to dashboard Cite

This paper demonstrates the use of dynamic laser speckle autocorrelation spectroscopy in conjunction with the photothermal treatment of nanoporous gold (np-Au) thin films to probe nanoscale morphology changes during the photothermal treatment. Utilizing this spectroscopy method, backscattered speckle from the incident laser is tracked during photothermal treatment and both the characteristic feature size and annealing time of the film are determined. These results demonstrate that this method can successfully be used to monitor laserbased surface modification processes without the use of ex-situ characterization. ©2016 Optical Society of America

show abstract

“…There are 3 major kinds of self-diffusion mechanisms in pure gold: lattice diffusion, grain boundary diffusion, and surface diffusion. Activation energies for these 3 kinds of diffusion are 1.71 eV [20], 0.88 eV [21], and 0.40 eV [22], respectively. Following Arrhenius relation, excellent correlation was seen between the experimental low-temperature Au-Au bonding results [9] and surface self-diffusion of pure Au.…”

Section: Bonding Interface Characterization and Mechanismsmentioning

confidence: 99%

Modeling, design, and demonstration of low-temperature Cu interconnections to ultra-thin glass interposers at 20 μm pitch

Wang

Smet

Kobayashi³

et al. 2014

2014 IEEE 64th Electronic Components and Technology Conference (ECTC)

View full text Add to dashboard Cite

This paper reports the first design and demonstration of a manufacturable 20 µm pitch Cu interconnection technology to ultra-thin glass interposers. Bonding is accomplished at temperatures below 200 o C without the need for solders. Manufacturability challenges such as substrate warpage, bump noncoplanarity and assembly throughput with low bonding times are addressed with this technology. The modeling and experimental results indicate that the ultra-fine pitch Cu interconnection offsets more than 3 µm non-coplanarity. Bonding interfaces were characterized to show that metallurgical bonding microstructure is formed even with a bonding time of 5 seconds, with superior electrical properties. A mechanism for low-temperature metallurgical bonding is proposed based on the characterization results.

show abstract

A study of surface diffusion on gold with an atomic force microscope

Cited by 66 publications

References 15 publications

Direct observation of liquid-like behavior of a single Au grain boundary

Direct observation of liquid-like behavior of a single Au grain boundary

Utilizing dynamic laser speckle to probe nanoscale morphology evolution in nanoporous gold thin films

Modeling, design, and demonstration of low-temperature Cu interconnections to ultra-thin glass interposers at 20 μm pitch

Contact Info

Product

Resources

About

A study of surface diffusion on gold with an atomic force microscope

Cited by 66 publications

References 15 publications

Direct observation of liquid-like behavior of a single Au grain boundary

Direct observation of liquid-like behavior of a single Au grain boundary

Utilizing dynamic laser speckle to probe nanoscale morphology evolution in nanoporous gold thin films

Modeling, design, and demonstration of low-temperature Cu interconnections to ultra-thin glass interposers at 20 &#x03BC;m pitch

Contact Info

Product

Resources

About

Modeling, design, and demonstration of low-temperature Cu interconnections to ultra-thin glass interposers at 20 μm pitch