2015
DOI: 10.1051/matecconf/20152702003
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A Study of Temperature, Microstructure and Hardness Properties of Sn-3.8Ag-0.7Cu (SAC) Solder Alloy

Abstract: Abstract. Solder alloys are one of the most crucial aspect linking the electrical components to the printed circuit board PCB substrate. Thus, producing a good solder is a must to say in electronic industries. Among major functions of solder alloys are to provide beneficial properties in melting, microstructure and mechanical strand. In this aspect, the Sn-3.8Ag-0.7Cu (SAC) solder alloys are recommended as potential candidate to assure these benefits. In this study, the solder possesses melting temperature of,… Show more

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Cited by 6 publications
(4 citation statements)
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“…As can be seen, the value for lead free solders (LFS) results comparable with the obtained for eutectic Sn-Pb. In all cases, the values obtained for the Cu mold are bigger than the ones obtained for the sand mold, as cooling rate influence on the solidification microstructure, and therefore in the resulting mechanical properties (Singh and Mhd.Noor, 2015). At lower cooling speed the dendritic structure is coarse and so the microhardness was lower.…”
Section: Microhardness Evolution During Artificial Isothermal Agingmentioning
confidence: 81%
See 1 more Smart Citation
“…As can be seen, the value for lead free solders (LFS) results comparable with the obtained for eutectic Sn-Pb. In all cases, the values obtained for the Cu mold are bigger than the ones obtained for the sand mold, as cooling rate influence on the solidification microstructure, and therefore in the resulting mechanical properties (Singh and Mhd.Noor, 2015). At lower cooling speed the dendritic structure is coarse and so the microhardness was lower.…”
Section: Microhardness Evolution During Artificial Isothermal Agingmentioning
confidence: 81%
“…At lower cooling speed the dendritic structure is coarse and so the microhardness was lower. The microhardness also depends on the alloying elements, the higher the content and the greater the hardness value in the range of hipo-eutectic compositions, due to higher content of intermetallic phases Ag 3 Sn and Cu 6 Sn 5 (Miyazawa and Ariga, 1999;Singh and Mhd.Noor, 2015). Thus, the highest value was obtained for the ternary eutectic alloy Sn-3.5% Ag-0.9%.…”
Section: Microhardness Evolution During Artificial Isothermal Agingmentioning
confidence: 99%
“…The Vicker’s hardness of In-Sn alloys, plotted in Figure 5 , closely matches the trends of the UTS data displayed in Figure 3 . The highest hardness value, 11.43 Hv, was detected in In-80Sn, although it is noted that this is still lower than the 14.4 Hv associated with the Sn-3.8 wt%Ag-0.7 wt%Cu SAC solder alloy [ 25 ].…”
Section: Resultsmentioning
confidence: 99%
“…The average shear strength result for the Sn-50Bi +2%TiO2 solder alloy is higher (42.40MPa) than the average shear strength of the Sn-50Bi solder alloy (40.78MPa). Among the crucial factor that affects the strength of any solder alloy and provides the solder the ability to withstand shear and tensile stresses is the intermetallic compound (IMC) layer formed between the solder alloy and the substrate [10].…”
Section: Advanced Materialsmentioning
confidence: 99%