A Study of the Inclusion of a Radioactive Addition Agent in Bright Nickel

Doty, W. R.; Riley, Bernard J.

doi:10.1149/1.2426505

Cited by 4 publications

(1 citation statement)

References 7 publications

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“…In the case of ferromagnetic materials, the effect of additives on the morphological evolution and physical properties of the deposits have been examined in some detail. The influence of dilute concentrations of species, such as saccharin, [19][20][21][22] quinoline, 23,24 thiourea, 25-27 coumarin 28,29 on improving film properties such as internal stress, 30,31 corrosion resistance, 32,33 and leveling the microroughness, have been widely reported. 25,29,[34][35][36] Among them, thiourea and coumarin are well-known levelers that reduce the difference in height between protruding and recessed surface features.…”

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confidence: 99%

Magnetic Materials for Three-Dimensional Damascene Metallization: Void-Free Electrodeposition of Ni and Ni[sub 70]Fe[sub 30] Using 2-Mercapto-5-benzimidazolesulfonic Acid

Lee

Bonevich

Davies

et al. 2008

J. Electrochem. Soc.

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Superconformal filling of submicrometer trenches with electrodeposited Ni is demonstrated using a NiSO 4 -NiCl 2 -FeSO 4 electrolyte containing 2-mercapto-5-benzimidazolesulfonic acid ͑MBIS͒. The process offers the ability to build three-dimensional magnetically active structures that may be easily integrated with other state-of-the-art metallization schemes. MBIS acts to inhibit Ni͑Fe͒ electrodeposition, although under certain conditions rapid, autocatalytic breakdown accompanies the onset of Ni deposition. Optimal trench filling is associated with the positive feedback process, moderated by electrolyte internal-resistance losses, and manifests as a hysteretic voltammetric response on planar electrodes for an MBIS concentration ϳ100 mol/L. On freshly immersed substrates, trench filling is characterized by an initial period of uniform growth followed by the development of a v-notch geometry associated with transient depletion of MBIS within the recessed feature. Interestingly, the finest submicrometer features are filled while only minimal deposition occurs on the neighboring free surface. Continued growth of the MBIS derived v-notch geometry also results in void-free filling of the larger features by geometrical leveling. The same behavior is observed for soft magnetic alloys, such as Ni-rich Ni-Fe alloys. Preliminary experiments indicated that MBIS does not significantly perturb the low coercivity of Ni-Fe alloys, an important attribute for prospective technical applications.

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