2024 25th International Conference on Electronic Packaging Technology (ICEPT) 2024
DOI: 10.1109/icept63120.2024.10668443
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A Study of the $\mu$ -Solder Joint on Ajinomoto Build-up Film using the Solder on Pad (SOP) process for Multi-Chip Module

Shuye Zhang,
Jinhong Liu,
Junfu Liu
et al.
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