A Study of the Shear Response of a Lead-Free Composite Solder by Experimental and Homogenization Techniques

Abstract

The current study proposes a combined experimental and modeling approach to characterize the mechanical response of composite lead-free solders. The influence of the reinforcement volume fraction on the shear response of the solder material in the joint is assessed. A novel optimized geometry for single lap shear specimens is proposed. This design minimizes the effect of plastic strain localization, leading to a significant improvement of the quality of experimental data. The constitutive model of the solder material is numerically identified from the load-displacement response of the joint by using inverse finite element identification. Experimental results for a composite solder with 0.13 reinforcement volume fraction indicate that the presence of the reinforcement leads to a 23% increase of the ultimate stress and a 50% decrease of the ultimate strain. To interpret experimental data and predict the elastoplastic response of the composite solder for varying particle volume fraction, a three-dimensional (3D) homogenization model is employed. The agreement between experiments and homogenization results leads to the conclusion that the increase in the ultimate strength and the decrease in ductility are to be attributed to load sharing between matrix material and particles with the development of a significant triaxial stress state which restricts plastic flow in the matrix.

Wetting and Soldering Behavior of Eutectic Au-Ge Alloy on Cu and Ni Substrates

“…For comparison, the strengths of Cu-Cu joints soldered with different Sn-Pb or Sn-Ag-(Cu,Ni) solders were reported to be in the range of 30 MPa to 70 MPa for shear loading and 60 MPa to 85 MPa for tensile loading. [25][26][27][28] The values determined in this work can therefore be considered as acceptable for technological applications.…”

Shear Strength and Aging Characteristics of Sn-3.0Ag-0.5Cu/Cu Solder Joint Reinforced with ZrO2 Nanoparticles

“…ZrO 2 NPs are chosen in the present work due to their effective surface active nature with good mechanical properties and chemical stability [9]. Among the various reliability testing methods, lap shear test resembles the real-life loading configuration experienced by the solder joints [8,16]. In the present study, lap shear test has been adopted to investigate the microstructure, Cu-Sn IMC growth and the shear strength of isothermally aged ZrO 2 added SAC 305/Cu joints with regard to the NPs size.…”

On the Mutual Effect of Viscoplasticity and Interfacial Damage Progression in Interfacial Fracture of Lead-Free Solder Joints

“…Since premature failure of the interface tends to considerably affect the results of tensile tests, 9 shear testing was chosen for characterization of the viscoplastic behavior of the SAC405 solder joint. The single-lap shear specimen design as presented by Sivasubramaniam et al, 30 because of its nearly uniform plastic strain distribution at the center of the joint, was utilized in this work. The geometry of the specimen and the setup used in the shear testing are shown in Fig.…”