2014 IEEE 23rd International Symposium on Industrial Electronics (ISIE) 2014
DOI: 10.1109/isie.2014.6864763
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A study of using nonnegative matrix factorization to detect solder-voids from radiographic images of solder

Abstract: Accurate detection of voids in solder bumps on ball grid arrays (BGAs) is important for improving device quality.Radiographic imaging is commonly used to inspect BGA packages incorporate into LSI circuits. In the case of conventional method, imaging is normally done four times, and the images obtained are averaged to reduce noises. We have developed a nonnegative matrix factorization method for detecting solder-voids using only three radiographic images. Computer simulation demonstrated that it has the same le… Show more

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Cited by 4 publications
(6 citation statements)
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“…We claim that the new ideas mentioned in 2) and 3) are different to previous existing methods (2)(3)(4)(5) .…”
Section: Introductionmentioning
confidence: 79%
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“…We claim that the new ideas mentioned in 2) and 3) are different to previous existing methods (2)(3)(4)(5) .…”
Section: Introductionmentioning
confidence: 79%
“…2a; although the physical fact suggests the void regions are brighter than neighborhood inside the solder ball, however, in reality these voids are quite difficult to be detected because of poor image contrast, irregular shapes, different void sizes and positions (2)(3)(4) , and high noise level (5) . These issues are what we have to overcome in practice.…”
Section: Void Detection Inside Each Solder Ballmentioning
confidence: 99%
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