2019
DOI: 10.4071/2380-4505-2019.1.000591
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A Study on Reduced/Absent Adhesion/Cap Layers for Optimized BEOL RC Performance

Abstract: Lower RC delay is vital to achieve optimal and competitive circuit performance and hence drives the endlessly pursued BEOL integration scheme advancement. To date low-k dielectric materials, i.e., fluorine-doped oxides, carbon-doped oxide (SiCOH), to porous carbon-doped oxides (p-SiCOH) have been implemented. However, due to the process integration challenges with inherently weak low-k materials, the trend to pursue lower k dielectrics has come to a plateau as technology nodes scale down past 20/14nm. On the o… Show more

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