ICSE 2000. 2000 IEEE International Conference on Semiconductor Electronics. Proceedings (Cat. No.00EX425)
DOI: 10.1109/smelec.2000.932444
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A study on silicon nodules due to the Si precipitation in wafer fabrication

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“…These particles are silicon nodules and could result in plate release failure. 11 This study employs the AD-10 solution to remove aluminum for two reasons. One is that some active surfactants in AD-10 etchant can assist the etchant to infiltrate small etch holes and thus make etch reaction speed up.…”
Section: Exploration Of Wet Etchant For Removing Sacrificial Metal Lamentioning
confidence: 99%
“…These particles are silicon nodules and could result in plate release failure. 11 This study employs the AD-10 solution to remove aluminum for two reasons. One is that some active surfactants in AD-10 etchant can assist the etchant to infiltrate small etch holes and thus make etch reaction speed up.…”
Section: Exploration Of Wet Etchant For Removing Sacrificial Metal Lamentioning
confidence: 99%