A Study on Warpage Behavior of Underfill in Flip Chip

Peng, Xiaohui; Ai, Wenji; Pan, Yan; Zhao, Guolin; Du, Xiaomeng; Zhu, Pengli

doi:10.1109/icept59018.2023.10492437

2023 24th International Conference on Electronic Packaging Technology (ICEPT) 2023

DOI: 10.1109/icept59018.2023.10492437

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A Study on Warpage Behavior of Underfill in Flip Chip

Xiaohui Peng,

Wenji Ai,

Yan Pan

et al.

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A Study on Warpage Behavior of Underfill in Flip Chip

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References 6 publications

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