A study on wiring pattern design for intelligent SiC power module with PEEC method

Masuda, Eisuke; Ibuchi, Takaaki; Funaki, Tsuyoshi; Otake, Hirotaka; Miyazaki, Tetsuya; Kanetake, Yasuo; Nakamura, Takashi

doi:10.1109/apemc.2017.7975465

Cited by 6 publications

(2 citation statements)

References 6 publications

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“…Sequence pair [81] , corner sequence [82] , O-tree [83] , B-tree [84] , adjacent constraint graph [85] Routing method Maze searching [86] , line searching [87] Layout evaluation Electrical evaluation FEA [34,78] , PEEC [88] , LBM [89] , equation-based method [90] Thermal evaluation CFD [35,91] , equation-based method [29,90,92] , FDM [90] , LBM [93] Optimization algorithm…”

Section: Component Representationmentioning

confidence: 99%

Review of Hybrid Packaging Methods for Power Modules

Ning,

Hui,

Kang

et al. 2023

Chin. J. Electr. Eng.

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The hybrid structure of a power-module package is summarized and classified. Basic and extended planar wire-bond designs are analyzed and compared with regular wire-bond modules and planar modules, respectively. The automatic layout method can improve the electrical and thermal performance of hybrid structures. A state-of-the-art hybrid structure is introduced, and suggestions for alleviating the current and temperature imbalances for future designs are provided.

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Section: Component Representationmentioning

confidence: 99%

Review of Hybrid Packaging Methods for Power Modules

Ning,

Hui,

Kang

et al. 2023

Chin. J. Electr. Eng.

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show abstract

“…Using an uniform mesh for capturing the skineffect easily may lead to a huge number of unknowns. This issue can be mitigated by resorting to a non-uniform mesh [33], which was shown also in [47]; however, the adoption of a non-uniform mesh may easily generate PEEC volume cells with high aspect ratios (thin and long cells) for which the analytical formulas can be affected by significant numerical errors.…”

Section: A Peec Modelling Challengesmentioning

confidence: 99%

Electromagnetic Modeling Approaches Towards Virtual Prototyping of WBG Power Electronics

Kovacevic-Badstuebner

Romano

Antonini

et al. 2018

2018 International Power Electronics Conference (IPEC-Niigata 2018 -ECCE Asia)

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High frequency power electronics utilizing wide-band gap semiconductor devices imposes more stringent requirements for highly accurate extraction of parasitics of power electronics systems in a wide frequency range. This paper presents the state-of-the-art modeling approaches used to predict the electromagnetic behavior of power electronic systems and components in terms of accuracy and computational cost. The potential of the Partial Element Equivalent Circuit (PEEC) technique for virtual prototyping of power electronic systems is assessed. The main advantage of this numerical technique is its capability for direct coupling between the circuit and electromagnetic domains provided by the PEEC meshing of threedimensional geometries in partial elements. The aim of this paper is to provide a more comprehensive understanding of PEEC-based modeling for power electronics packaging.

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Review of Radiated EMI Modeling and Mitigation Techniques in Power Electronics Systems

Lai

Yang

et al. 2023

2023 IEEE Applied Power Electronics Conference and Exposition (APEC)

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A study on wiring pattern design for intelligent SiC power module with PEEC method

Cited by 6 publications

References 6 publications

Review of Hybrid Packaging Methods for Power Modules

Review of Hybrid Packaging Methods for Power Modules

Electromagnetic Modeling Approaches Towards Virtual Prototyping of WBG Power Electronics

Review of Radiated EMI Modeling and Mitigation Techniques in Power Electronics Systems

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