Abstract:In this work, we present a substrate removal procedure for solar cells compatible with direct attachment of the epitaxy to a holder through a thermally and electrically conductive interface. In our case this procedure was motivated by the need to develop a processing technique compatible with lowtemperature characterization of the devices. The method is based on the use of indium to bond a thin-film epitaxial structure to a silicon support. The adequate properties of indium, namely, low tensile strength and go… Show more
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