2021
DOI: 10.1002/ange.202100984
|View full text |Cite
|
Sign up to set email alerts
|

A Superstrong and Reversible Ionic Crystal‐Based Adhesive Inspired by Ice Adhesion

Abstract: In this study,w ed eveloped as uperstrong and reversible adhesive,whichcan possess ahigh bonding strength in the "adhesive" state and detach with the application of heating.A ni onic crystal (IC) gel, in whicha nI Cw as immobilized within as oft-polymer matrix, were synthesized via in situ photo-crosslinking of aprecursor solution composed of N, N-dimethyl acrylamide (DMAA) and am elted IC.T he obtained IC gel is homogenous and transparent at melt point. When cooled to the phase transition temperature of the I… Show more

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
3
1
1

Citation Types

0
19
1

Year Published

2021
2021
2024
2024

Publication Types

Select...
9

Relationship

6
3

Authors

Journals

citations
Cited by 21 publications
(20 citation statements)
references
References 57 publications
0
19
1
Order By: Relevance
“…The tensile strength of TPT-PAN nanofibers is 3.2 MPa, while the CEN nanofibers exhibit a much higher tensile strength of 18.8 MPa. The Young’s modulus of the CEN separator can be determined from the tensile test data . As shown in Figure S2, the modulus of the TPT-PAN nanofibers increases from 0.61 to 100 MPa after cross-linking.…”
Section: Resultsmentioning
confidence: 99%
“…The tensile strength of TPT-PAN nanofibers is 3.2 MPa, while the CEN nanofibers exhibit a much higher tensile strength of 18.8 MPa. The Young’s modulus of the CEN separator can be determined from the tensile test data . As shown in Figure S2, the modulus of the TPT-PAN nanofibers increases from 0.61 to 100 MPa after cross-linking.…”
Section: Resultsmentioning
confidence: 99%
“…Initiated by the reversible adhesion phenomena of ice/melting, we developed a reversible adhesive ionic crystal (IC) gel, which was prepared by in situ photo‐ crosslinking a precursor consisting of N , N ‐dimethylarylamide (DMAA) and an imidazolium IC. [ 62 ] The IC gel exhibited a high adhesive strength on many substrates upon cooling below the melting temperature of the IC. The adhesive layer can be detached upon heating and re‐adhesion via cooling.…”
Section: Pil‐based Smart Materials and Electronic Devicesmentioning
confidence: 99%
“…[9][10][11][12][13][14] However, most flexible electronic skins with hexafluorophosphate (PF 6 − ), PILs may be converted from hydrophilic to hydrophobic. [49,50] In addition, the PILs can interact with the negatively charged bacterial surface, allowing hydrophobic chain segments (such as alkyl chains) to enter into the bacterial lipid membrane, resulting in the bacterium collapsing, breaking, and dying. As a result, they exhibit a broad spectrum of antibacterial characteristics and have been extensively investigated as antimicrobial materials.…”
Section: Introductionmentioning
confidence: 99%