A surface-mounted device assembly technique for small optics based on laser reflow soldering

Stauffer, Laurent; Würsch, A.; Gächter, B.F.; Siercks, K.; Verettas, I; Rossopoulos, S.; Clavel, Reymond

doi:10.1016/j.optlaseng.2004.03.009

Cited by 14 publications

(2 citation statements)

References 2 publications

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“…Contact-free heating could be provided by Joule heating using integrated resistive layers as demonstrated by the Pick&Align soldering technique [15]. Laser irradiation is a very versatile tool to reflow localized solder volumes as shown by the TRIMO approach for surface-mounted optics [16], by thin film laser soldering processes [17], and by Solderjet Bumping [18].…”

Section: Laser-based Solderjet Bumpingmentioning

confidence: 99%

Optical path difference evaluation of laser-soldered optical components

Burkhardt

Hornaff

Burkhardt

et al. 2015

J. Eur. Opt. Soc.-Rapid Publ.

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We present Solderjet Bumping, a laser-based soldering process, as an all inorganic joining technique for optical materials and mechanical support structures. The adhesive-free bonding process enables the low-stress assembly of fragile and sensitive components for advanced optical systems. Our process addresses high demanding applications, e.g. under high energetic radiation (short wavelengths of 280 nm and below and/or high intensities), for vacuum operation, and for harsh environmental conditions. Laser-based soldering allows the low stress assembly of aligned sub-cells as key components for high quality optical systems. The evaluation of the optical path difference in fused silica and the radiation resistant LAK9G15 glass components after soldering and environmental testing shows the potential of the technique.

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Section: Laser-based Solderjet Bumpingmentioning

confidence: 99%

Optical path difference evaluation of laser-soldered optical components

Burkhardt

Hornaff

Burkhardt

et al. 2015

J. Eur. Opt. Soc.-Rapid Publ.

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“…Soldering, which is a reflow process based on surface mount technology, is the most commonly used process for bonding between some electronic packages and substrates for second level packaging. This is because soldering is capable of being used in mass production at low costs [ 16 ]. However, the conventional reflow process is difficult to use for bonding with miniaturized electronic components and may cause thermal damage [ 17 , 18 , 19 ].…”

Section: Introductionmentioning

confidence: 99%

Interfacial Reactions and Mechanical Properties of Sn–58Bi Solder Joints with Ag Nanoparticles Prepared Using Ultra-Fast Laser Bonding

Jeong

Baek

et al. 2021

Materials

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The effects of Ag nanoparticle (Ag NP) addition on interfacial reaction and mechanical properties of Sn–58Bi solder joints using ultra-fast laser soldering were investigated. Laser-assisted low-temperature bonding was used to solder Sn–58Bi based pastes, with different Ag NP contents, onto organic surface preservative-finished Cu pads of printed circuit boards. The solder joints after laser bonding were examined to determine the effects of Ag NPs on interfacial reactions and intermetallic compounds (IMCs) and high-temperature storage tests performed to investigate its effects on the long-term reliabilities of solder joints. Their mechanical properties were also assessed using shear tests. Although the bonding time of the laser process was shorter than that of a conventional reflow process, Cu–Sn IMCs, such as Cu6Sn5 and Cu3Sn, were well formed at the interface of the solder joint. The addition of Ag NPs also improved the mechanical properties of the solder joints by reducing brittle fracture and suppressing IMC growth. However, excessive addition of Ag NPs degraded the mechanical properties due to coarsened Ag3Sn IMCs. Thus, this research predicts that the laser bonding process can be applied to low-temperature bonding to reduce thermal damage and improve the mechanical properties of Sn–58Bi solders, whose microstructure and related mechanical properties can be improved by adding optimal amounts of Ag NPs.

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