A Survey on Test pattern compression Techniques in Analog and Mixed signal circuits

Abstract

Testing of modern IC devices involves three process: 1. Test pattern generation, 2. Test pattern compaction, 3. Test pattern application. Test patterns are generated in first phase, compressed in second phase and applied to DUT (Device under Test). The response of DUT is compared with actual response in order to analyze the device's behaviors. Earlier part of modern device evolves with digital circuits. But most of modern IC's in today's technology comes with both analog (ADC) and digital elements (DAC). There are many scheme's has been developed for digital circuits than analogue circuits. Testing of analogue circuits are more difficult than digital circuits since the analog test involves more parameter than digital testing. So there is need of efficient test compression. The survey of this paper is focused on test compression techniques and its analysis on methodology, test patterns, run time on various analogue & mixed signal circuits.