A Synergy Effect of 2-MBT and PE-3650 on the Bottom-Up Filling in Electroless Copper Plating

Zan, Lingxing; Liu, Zong–Huai; Yang, Zupei; Wang, Zenglin

doi:10.1149/2.018112esl

Cited by 18 publications

(9 citation statements)

References 13 publications

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“…[1][2] The unsmooth microvia geometry causes the current density on the board surface of microvia larger than that at the bottom. 3 However, the uneven local current density contribution gives rise to void microvia filling or conformal deposition.…”

mentioning

confidence: 99%

Investigation of Nitrogen Heterocyclic Compounds as Levelers for Electroplating Cu Filling by Electrochemical Method and Quantum Chemical Calculation

Ren

Lei

Wang

2015

J. Electrochem. Soc.

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A series of nitrogen heterocyclic compounds (NHCs) bearing different functional groups were investigated as levelers for electroplating Cu microvia filling. The cathodic potential decreased with an injection of 4-amino-6-hydroxy-2-mercapto-pyrimidine (AHMP), 4-hydroxy-2-mercapto-6-methyl-pyrimidine (HMMP), 6-dimethyl-2-pyrimidinethiol (DPT), or 2-mercaptopyridine (2-MP), whlie the cathodic potential increased with an addition of 2-MPD. To evaluate filling performance of a plating solution on an addition of the leveler, the relationship between the super filling capability (SFC) of the plating solution and the Cu stripping quantity was proposed. The SFC was positively associated with the filling performance of the microvias, and the high SFC value was conducive to improve the filling performance of microvia and to reduce thickness of plated Cu film on the surface. Furthermore, the adsorption ability and active functional groups of NHCs were analyzed by quantum chemical calculations. Different from the conventional nitrogen active sites in quaternary ammoniums, the -SH and = S groups in the NHCs were the most active reaction sites for surface adsorption on Cu surface and the adsorption ability of NHCs was negative correlation with energy gap ( E). In addition, scanning electron microscope and X-ray diffraction results indicated that the uniformity and brightness of the electroplated Cu film were improved by an addition of AHMP, HMMP, DPT, and 2-MP due to a significant change of the Cu crystalline orientation in plating deposition.

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confidence: 99%

Investigation of Nitrogen Heterocyclic Compounds as Levelers for Electroplating Cu Filling by Electrochemical Method and Quantum Chemical Calculation

Ren

Lei

Wang

2015

J. Electrochem. Soc.

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“…Recently, printed circuit boards (PCBs) with high-density interconnection (HDI) have received a lot of attention due to the wide application in 5G communication, wearable devices, and other booming fields. − As is well known, the copper electrodeposition in acidic electrolytes plays a critical role in PCB manufacture. , The copper electroplating of the through-holes (THs) is especially performed to obtain the conductive interconnection between the layers in multilayer PCB. The growing complexity of electronic products promotes the development of HDI technology and puts forward higher quality requirements for the copper coating of TH. − Nevertheless, there are still several challenges to meet the electronic product trend of miniaturization, integration, and portability.…”

Section: Introductionmentioning

confidence: 99%

Copolymer of Pyrrole and 1,4-Butanediol Diglycidyl as an Efficient Additive Leveler for Through-Hole Copper Electroplating

Zhou

Yan

et al. 2020

ACS Omega

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A copolymer comprising of pyrrole and 1,4-butanediol diglycidyl ether (PBDGE) was designed and synthesized as a leveler to improve the throwing power for printed circuit board (PCB) through-hole electroplating. The results of linear sweep voltammetry (LSV), galvanostatic measurements (GMs), and cyclic voltammetry (CV) reveal the strong coordination effect of PBDGE with other additives and confirm the advantageous performance of PBDGE to effectively assist the electroplating of through-hole. An increment of 35.5% in the throwing power was achieved under the addition of PBDGE in through-hole plating. Additionally, the reaction mechanism was studied by quantum chemical calculations and molecular dynamics (MD) simulations, indicating that the pyrrole rings of the PBDGE molecule are adsorbed on the copper surface as the adsorption sites to balance the copper plating regardless of the through-hole position differences.

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“…13 Among these additives, 2-MBT is especially attractive because while improving coating quality, it accelerates the electroless copper plating process rather than decelerating it. 14,15 To date, the understanding of the plating process with 2-MBT is very limited. Previous works mainly focused on optimizing process while effects of 2-MBT additions on the electroless copper plating process are still remain not fully understood.…”

Section: Introductionmentioning

confidence: 99%

The effect of 2-mercaptobenzothiazole on laser-assisted electroless copper plating

Xiang

Qian³

et al. 2016

RSC Adv.

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A Synergy Effect of 2-MBT and PE-3650 on the Bottom-Up Filling in Electroless Copper Plating

Cited by 18 publications

References 13 publications

Investigation of Nitrogen Heterocyclic Compounds as Levelers for Electroplating Cu Filling by Electrochemical Method and Quantum Chemical Calculation

Investigation of Nitrogen Heterocyclic Compounds as Levelers for Electroplating Cu Filling by Electrochemical Method and Quantum Chemical Calculation

Copolymer of Pyrrole and 1,4-Butanediol Diglycidyl as an Efficient Additive Leveler for Through-Hole Copper Electroplating

The effect of 2-mercaptobenzothiazole on laser-assisted electroless copper plating

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