A System for Electromechanical Reliability Testing of MEMS Devices

Abstract

This paper reports on a setup and a method that enables automated analysis of mechanical stress impact on microelectromechanical systems (MEMS). In this setup both electrical and optical inspection are available. Reliability testing is possible on a single chip as well as on the wafer level. Mechanical stress is applied to the tested structure with programmable static forces up to 3.6 N and dynamic loads at frequencies up to 20 Hz. The applications of the presented system include the postmanufacturing test, characterization and stress screens as well as reliability studies. We report preliminary results of long-term reliability testing obtained for a CMOS-based stress sensor.

Flexible 3D Force Sensor Based on Polymer Nanocomposite for Soft Robotics and Medical Applications

“…A 3D force, based on micromachined single crystal silicon, was introduced and analyzed for its capability to quantify forces [ 23 ]. The sensor used a cross-structure design and flexible hinges for its elastic structure.…”