A Technique for Estimation of Residual Stress and Young’s Modulus of Compressively Stressed Thin Films Using Microfabricated Beams

Behera, Amruta Ranjan; Shaik, Habibuddin; Rao, G. Mohan; Pratap, Rudra

doi:10.1109/jmems.2019.2948016

Cited by 10 publications

(4 citation statements)

References 51 publications

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“…The various deposition and etching processes affect the thicknesses and widths of the MEMS structures. These parameters change the material properties, such as Young’s modulus, affected by the deposition process [ 20 ]. The structure imbalance, temperature effect, and stresses cause a drastic shift in the operating resonant frequencies.…”

Section: Fundamentals Of Vibrating Gyroscopesmentioning

confidence: 99%

A Review of MEMS Vibrating Gyroscopes and Their Reliability Issues in Harsh Environments

Gill

Howard

Mazhar

et al. 2022

Sensors

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Micro-electromechanical systems (MEMS) vibrating gyroscopes have gained a lot of attention over the last two decades because of their low power consumption, easy integration, and low fabrication cost. The usage of the gyroscope equipped with an inertial measurement unit has increased tremendously, with applications ranging from household devices to smart electronics to military equipment. However, reliability issues are still a concern when operating this inertial sensor in harsh environments, such as to control the movement and alignment of mini-satellites in space, tracking firefighters at an elevated temperature, and assisting aircraft navigation in gusty turbulent air. This review paper focuses on the key fundamentals of the MEMS vibrating gyroscopes, first discussing popular designs including the tuning fork, gimbal, vibrating ring, and multi-axis gyroscopes. It further investigates how bias stability, angle random walk, scale factor, and other performance parameters are affected in harsh environments and then discusses the reliability issues of the gyroscopes.

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Section: Fundamentals Of Vibrating Gyroscopesmentioning

confidence: 99%

A Review of MEMS Vibrating Gyroscopes and Their Reliability Issues in Harsh Environments

Gill

Howard

Mazhar

et al. 2022

Sensors

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“…Thermal stress caused by the mismatch of the coefficients of thermal expansion(CTE) in the multilayer structure is often the main cause of the failure of the thin film devices [16,17] .Peng et al used the finite element method to model and simulate a simulated test structure and observe the mechanical response of the beam by calculating the residual stress of the film, a technique that can be used to monitor the magnitude of stress in the film, saving operation time and cost [18] . Amruta Ranjan Behera et al proposed a technique for estimating the residual stress and Young's modulus of compressive stressed films using micromachined beams, making it more reliable to estimate the residual stress of post-manufacturing test and measurement [19] .…”

Section: Introductionmentioning

confidence: 99%

Finite element simulation and experiment of residual stress evolution in MEMS structures

Wen,

Chen,

Huang

et al. 2024

J. Phys.: Conf. Ser.

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The MEMS device structure is usually formed by the combination of thick film and thin film deposition of many different materials, and the residual stress generated in the process of integration/superposition of different materials has a significant impact on the performance and reliability of the device.In this study, a test structure of a multilayer thin film was designed and processed. Based on this, finite element modeling analysis and reliability experiment, analyze the evolution of residual stress and construct the corresponding theoretical analysis model. The finite element modeling analysis can characterize the evolution and distribution laws of residual stress. The reliability experiment is mainly by carrying out the temperature shock experiment, and measuring the resistance value, resonance frequency and the surface morphology of the device, so as to better reflect the change of residual stress. Through this study, the resonant frequency and surface morphology of the device can reflect the residual stress of the device, which provides help for the test and analysis of the residual stress. To a certain extent, it can help reduce the harm caused by the residual stress in the design and manufacturing process, and improve the performance and reliability of MEMS devices.

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“…At this level, the determination of the Young's modulus requires very different procedures to the traditional uniaxial tensile tests of bulk samples. Several techniques, including nanoindentation [3][4][5], bulge test [6][7][8], electrostatic pull-in experiments [9,10], or resonantbased methods [11,12] have been developed for this purpose. However, they often require complex experimental setups and extraction procedures that complicate the replicability of the experimental results.…”

Section: Introductionmentioning

confidence: 99%

Estimation of the Young’s Modulus of Nanometer-Thick Films Using Residual Stress-Driven Bilayer Cantilevers

et al. 2022

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Precise prediction of mechanical behavior of thin films at the nanoscale requires techniques that consider size effects and fabrication-related issues. Here, we propose a test methodology to estimate the Young’s modulus of nanometer-thick films using micromachined bilayer cantilevers. The bilayer cantilevers which comprise a well-known reference layer and a tested film deflect due to the relief of the residual stresses generated during the fabrication process. The mechanical relationship between the measured residual stresses and the corresponding deflections was used to characterize the tested film. Residual stresses and deflections were related using analytical and finite element models that consider intrinsic stress gradients and the use of adherence layers. The proposed methodology was applied to low pressure chemical vapor deposited silicon nitride tested films with thicknesses ranging from 46 nm to 288 nm. The estimated Young’s modulus values varying between 213.9 GPa and 288.3 GPa were consistent with nanoindentation and alternative residual stress-driven techniques. In addition, the dependence of the results on the thickness and the intrinsic stress gradient of the materials was confirmed. The proposed methodology is simple and can be used to characterize diverse materials deposited under different fabrication conditions.

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A Technique for Estimation of Residual Stress and Young’s Modulus of Compressively Stressed Thin Films Using Microfabricated Beams

Cited by 10 publications

References 51 publications

A Review of MEMS Vibrating Gyroscopes and Their Reliability Issues in Harsh Environments

A Review of MEMS Vibrating Gyroscopes and Their Reliability Issues in Harsh Environments

Finite element simulation and experiment of residual stress evolution in MEMS structures

Estimation of the Young’s Modulus of Nanometer-Thick Films Using Residual Stress-Driven Bilayer Cantilevers

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