2015
DOI: 10.3390/electronics4040947
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A Technique for Mitigating Thermal Stress and Extending Life Cycle of Power Electronic Converters Used for Wind Turbines

Abstract: Over the last two decades, various models have been developed to assess and improve the reliability of power electronic conversion systems (PECs) with a focus on those used for wind turbines. However, only few studies have dealt with mitigating the PECs thermo-mechanical effects on their reliability taking into account variations in wind characteristics. This work critically investigates this issue and attempts to offer a mitigating technique by, first, developing realistic full scale (FS) and partial scale (P… Show more

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Cited by 13 publications
(22 citation statements)
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References 31 publications
(35 reference statements)
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“…Thermal resistance R th and capacitance C th for each individual of Foster equivalent thermal network, as shown in Figure 7b, were extracted by curve fitting using least square method. The equivalence of foster thermal [28] network is defined in Equation (17) as:…”
Section: Methodsmentioning
confidence: 99%
See 1 more Smart Citation
“…Thermal resistance R th and capacitance C th for each individual of Foster equivalent thermal network, as shown in Figure 7b, were extracted by curve fitting using least square method. The equivalence of foster thermal [28] network is defined in Equation (17) as:…”
Section: Methodsmentioning
confidence: 99%
“…Temperature, T j , of each layer was represented for heating source. By applying forward rectangular Euler's rule, thermal equation in z-domain is [28]:…”
Section: Methodsmentioning
confidence: 99%
“…In order to detect such temperature induced failure occurring, accurate electro thermal modelling is essential. Proper thermal models with heat coupling effect analysis were considered in [10] [11]. These works studied a thermal impedance matrix that was convenient for thermal coupling effect estimations and most suitable way to represent actual heat path through the device.…”
Section: Introductionmentioning
confidence: 99%
“…The electro thermal and thermo mechanical test was performed by real-time application with dSPACE system. The case studies included a fixed and adjustable switching frequency of operation derived in [11]. The results were used to define total lifetime consumption (TLC) for the IGBT wire bonds.…”
Section: Introductionmentioning
confidence: 99%
“…High average temperature may significantly reduce the reliability of power modules [11,12]. However, reliability strongly depends on thermal cycles mainly caused by these components [13,14]. Thermal cycles are the main source of failure in power modules, especially due to the effect of breaking the connections between the dies and bond wires, due to the mechanical fatigue caused by dilations and contractions resulting from these thermal cycles [14].…”
mentioning
confidence: 99%