A terahertz-band branch waveguide directional coupler based on micro-machining

Zhou, Yihong; Hu, Jia; Liu, S.; Zhang, Y.

doi:10.1109/iccps.2014.7062258

Cited by 7 publications

(3 citation statements)

References 5 publications

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“…Many THz component manufacturing technologies for waveguide structures have been proposed, such as computer numerical control milling (CNC), [1][2][3] photolithography process, 4 and deep reactive ion etching process. 5,6 However, as the size of the component decreases for the shorter wavelength, the tolerance for the fabrication process becomes increasingly tight. The conductor loss of the waveguide is largely increased as the effect of surface roughness becomes significant.…”

Section: Introductionmentioning

confidence: 99%

“…In the THz band, rectangular waveguides are preferred for their low loss compared to planar structures. Many THz component manufacturing technologies for waveguide structures have been proposed, such as computer numerical control milling (CNC), 1–3 photolithography process, 4 and deep reactive ion etching process 5,6 . However, as the size of the component decreases for the shorter wavelength, the tolerance for the fabrication process becomes increasingly tight.…”

Section: Introductionmentioning

confidence: 99%

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Terahertz couplers based on branch lines and waveguide resonators

Li,

Cheng

2024

Micro & Optical Tech Letters

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This paper presents two waveguide quadrature hybrids in the WR‐3 band, which are designed to be fabricated by computer numerical control milling process with relaxed branch width requirements. An E‐plane four‐branch directional coupler gives an amplitude imbalance less than 0.8 dB and a phase difference between 88° and 94° from 240 to 324 GHz. Another design is an H‐plane bandpass coupler composed of cavity resonators, showing a bandwidth of 2% near 300 GHz.

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Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Terahertz couplers based on branch lines and waveguide resonators

Li,

Cheng

2024

Micro & Optical Tech Letters

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“…The conventional highfrequency microwave devices used for amplification such as the helix and coupled cavity, TWTSs, cannot be easily modified to operate in THz region. Researchers [13][14][15][16][17][18][19] have extensively used masking and deposition techniques on silicon to design and develop THz waveguide components. This process is particularly suitable for making 2D components in bulk, but tool-based micromilling can make 3D shapes on variety of materials in small quantities with surface roughness as good as 75 nm R a as is reported by Groppi et al [20].…”

Section: Introductionmentioning

confidence: 99%

Micromachining and Characterisation of Folded Waveguide Structure at 0.22THz

Bhardwaj

Sudhamani

Dutta

et al. 2021

J Infrared Milli Terahz Waves

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The demand of high-speed wireless communication has increased, which need the data rate to be in the order of Terabyte per second (Tbps) in the near future. Terahertz (THz) band communication is a key wireless communication technology to satisfy this future demand. This would also reduce the spectrum scarcity and capacity limitation of current wireless systems. Microfabricated Folded Waveguide TWTs are the potential compact sources of wide band and high-power terahertz radiation. This study primarily focuses on machining technology for THz waveguide components requiring ultra-high precision micromachining. Rectangular waveguides, especially Folded Waveguides (FW), are even more difficult to manufacture using conventional machining techniques due to their small size and very tight tolerances. The criticalities in micromachining of FW for 0.22 THz have been addressed in this article. Half hard free cutting Brass IS 319-H2 was used as a work material due to its electrical and mechanical properties. Waveguide size of 0.852 × 0.12 mm was machined within ± 3–5 μm linear tolerances, surface roughness in the order of 45 nm Ra, and flatness less than half of wavelength (< λ/2). The split top and bottom blocks of the folded waveguide were aligned by dowel pins which matched within a tolerance of ± 5 μm. The perpendicularity and parallelism were maintained within 5 μm tolerance. This work explored and established the application of micromilling as reasonably suitable for the THz waveguides followed by ultrasonic cleaning as deburring. It also investigated the measured folded waveguide losses which were close to simulated values.

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