2014 International Conference on Microelectronic Test Structures (ICMTS) 2014
DOI: 10.1109/icmts.2014.6841476
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A test structure for analysis of temperature distribution in stacked IC with sensing device array

T. Matsuda
1
,
Keita Yamada
2
,
Hideyuki Iwata
3
et al.
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Cited by 3 publications
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Analysis of temperature distribution in stacked IC with a thermal simulation and a specially designed test structure

Yamada
1
,
Matsuda
2
,
Iwata
3
et al. 2014
2014 International Conference on Electronics Packaging (ICEP)
1
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Analysis of temperature distribution in stacked IC with a thermal simulation and a specially designed test structure

Yamada
1
,
Matsuda
2
,
Iwata
3
et al. 2014
2014 International Conference on Electronics Packaging (ICEP)
1
0
0
0
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Analysis of Temperature Distribution in Stacked IC With On-Chip Sensing Device Arrays

Matsuda
1
,
Yamada
2
,
Demachi
3
et al. 2015
IEEE Trans. Semicond. Manufact.
4
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Analysis of Metal Wire Effect on Temperature Distribution in Stacked IC With Thinned Chip

Matsuda
1
,
Demachi
2
,
Iwata
3
et al. 2017
IEEE Trans. Semicond. Manufact.
1
0
2
0
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