A Thermal Management Approach to Fault-Resilient Design of Three-Level IGCT-Based NPC Converters

Rocha, Anderson V.; Paula, Hélder de; Santos, Manoel E. dos; Filho, Braz J. Cardoso

doi:10.1109/tia.2013.2265935

Cited by 10 publications

(2 citation statements)

References 12 publications

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“…Another thermal management technique focusing on the fault-resilient design of an integrated gate-commutated thyristor (IGCT) based 3-level NPC converter is discussed in [255]. The results obtained showed that through the optimized design of busbars and regulation of temperature, the IGCTs could withstand converter shoot-through situations even if there is a failure in the circuit breakers.…”

Section: B Thermal Management During Fault Conditionmentioning

confidence: 99%

Emerging Trends and Challenges in Thermal Management of Power Electronic Converters: A State of the Art Review

Rahman,

Moghassemi,

Arsalan

et al. 2024

IEEE Access

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Recently, the thermal management of power electronic converters has gained significant attention due to the continuous trend of developing very compact power electronic converters with high power density. With the evolution of power semiconductor devices, high operating temperatures and large thermal cycles have become possible, necessitating a significant improvement in thermal system designs. Researchers have made significant efforts to develop effective thermal management systems for improving the reliability and lifetime of power electronic converters. This article intends to present a thorough review of thermal management systems employed in power electronics cooling. The applied thermal management techniques have been reviewed from the perspective of electrical parameter regulation and heat dissipation control. Regulation of electrical parameters involves active thermal control, which is a method for controlling junction temperature and thermal cycling of power semiconductor devices. The active thermal control implementation processes reviewed in this article consist of increasing overload capacity, manipulating switching and conduction losses, employing modified modulation process, balancing thermal stress at the converter level, and controlling thermal stress at the system level. Control of heat dissipation can be achieved through direct and indirect cooling of power electronic converters with air or liquid as the coolant. The effectiveness and implementation methods of these cooling techniques, such as channel cooling, phase change material-based cooling, immersion cooling, jet impingement and spray cooling, are reviewed in this paper. Moreover, performance-enhancing ideas and challenges for these techniques are discussed. The primary objective of this review paper is to bridge the existing gap in the literature by offering a comprehensive comparison of commonly employed thermal management techniques. INDEX TERMSActive thermal control (ATC), Power semiconductor device (PSD), Microchannel, Spray cooling, Jet impingement, Immersion cooling, Phase change material (PCM), and Active cooling.

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Section: B Thermal Management During Fault Conditionmentioning

confidence: 99%

Emerging Trends and Challenges in Thermal Management of Power Electronic Converters: A State of the Art Review

Rahman,

Moghassemi,

Arsalan

et al. 2024

IEEE Access

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“…Responsible for driving key processes in modern systems, the high availability of the ANPC and NPC power converters is mandatory, since their maintenance or replacement imply downtimes incompatible with the requirements of the production processes [7]- [9]. The faulttolerant operation of such converters has been addressed in the technical literature, but the main pro result in more complexity and higher parts c…”

mentioning

confidence: 99%

A new fault-tolerant realization of the active three-level NPC converter

Rocha

Silva

Pires³

et al. 2014

2014 IEEE Energy Conversion Congress and Exposition (ECCE)

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The three-level (3L) neutral-point-clamped (NPC) voltage-source (VSC) converter has been the standard solution in medium-voltage range for industrial applications. Recently, the NPC converter structure was improved by adding two extra active switches per phase leg, thus overcoming one of its main drawbacks: the unequal power loss among the power semiconductors. The resulting structure became known as active NPC (ANPC) converter. The high availability of these power converters is mandatory, since their maintenance or replacement imply equipment downtimes incompatible with the requirements of the production processes. The faulttolerant operation of such converters has been addressed in the technical literature, but the main proposed solutions result in more complexity and higher parts count. This work proposes a new fault-tolerant structure for the ANPC IGBT-based converter, using standard devices, with very low additional cost and small complexity. The main goal is to show that the ANPC converter can overcome different and successive failures in its power devices without loss of functionality, before its definitive downtime.

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Accurate measurement of thermal conductivity of micro-quantity liquids by dielectric transient current method

Chen

Zheng

2023

Applied Thermal Engineering

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A Thermal Management Approach to Fault-Resilient Design of Three-Level IGCT-Based NPC Converters

Cited by 10 publications

References 12 publications

Emerging Trends and Challenges in Thermal Management of Power Electronic Converters: A State of the Art Review

Emerging Trends and Challenges in Thermal Management of Power Electronic Converters: A State of the Art Review

A new fault-tolerant realization of the active three-level NPC converter

Accurate measurement of thermal conductivity of micro-quantity liquids by dielectric transient current method

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