2017
DOI: 10.1007/s10854-017-8454-5
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A thermally conductive and insulating epoxy polymer composite with hybrid filler of modified copper nanowires and graphene oxide

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Cited by 23 publications
(17 citation statements)
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“…[38] ( Table 8) 3.11 Thermal conductivity of EPDM/TiC composites The addition of 20% POE can further boost the thermal conductivity of EPDM/TiC 10/2 surrounding TiC particles to facilitate the conduction of heat in EPDM. [16] ( Table 9)…”
Section: 8 Mechanical Properties Of Epdm/tic Compositesmentioning
confidence: 99%
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“…[38] ( Table 8) 3.11 Thermal conductivity of EPDM/TiC composites The addition of 20% POE can further boost the thermal conductivity of EPDM/TiC 10/2 surrounding TiC particles to facilitate the conduction of heat in EPDM. [16] ( Table 9)…”
Section: 8 Mechanical Properties Of Epdm/tic Compositesmentioning
confidence: 99%
“…The application of coupling agents can reduce such aggregation and improve the properties of polymer/filler composites. [8,[15][16] In this study, TiC particles are firstly surface modified by coupling agent isopropyl trioleic titanate (NDZ105) to reduce the agglomeration of TiC particles in EPDM matrix. [17][18] Then, different amount of TiC particles is added into EPDM matrix to investigate the effect of modified TiC on the bound rubber content, cure, crosslink density, rheological, mechanical and dialectical properties of EPDM/TiC composites.…”
Section: Introductionmentioning
confidence: 99%
“…The functional CuNW has been used to enhance the thermal conductivity, surface morphology, and dielectric properties of nanocomposite. Li et al 67 fabricated polydopamine (PDA)-modified CuNW (CuNW@PDA) and graphene oxide (GO@PDA). The nanofillers were used to reinforce epoxy nanocomposites.…”
Section: Devicementioning
confidence: 99%
“…Li et al. 67 fabricated polydopamine (PDA)-modified CuNW (CuNW@PDA) and graphene oxide (GO@PDA). The nanofillers were used to reinforce epoxy nanocomposites.…”
Section: Polymer/nanowire Nanocompositementioning
confidence: 99%
“…However, due to its high electrical conductivity (6000 S/cm), when used as a heat dissipating material, electrical short problems can occur, which can lead to malfunction of the electronic device. 614 On the other hand, hexagonal boron nitride ( h- BN) has a hexagonal layered structure similar to graphite and has a high thermal conductivity (∼ 600 W/m·K) as well as decent thermal resistance and electrical resistance (10 13 Ω·cm). 1517 It can be used as a filler that improves the electrical resistance of the heat dissipation material as well as the thermal conductivity.…”
Section: Introductionmentioning
confidence: 99%