A three-dimensional high-throughput architecture using through-wafer optical interconnect

Architecture of a Terabit Free-Space Intelligent Optical Backplane

“…Several planar PCB substrates can in principle be arranged in a linear array, as shown in Fig. 1, and optically interconnected in the 3rd dimension using optical transmission through transparent substrates (i.e., see [7,14,34] for a description of such technologies), yielding a compact 3-dimensional optical mesh-like structure, as shown in Fig. 10c.…”

“…Space division multiplexing exploits the large 2D spatial bandwidth made available on a single die and the large 3D spatial bandwidth made available through free-space. Figure 2 illustrates one possible organization of the optical backplane, based on the concept of``logically transparent'' processing boards (i.e., also see [7,14,34] for descriptions of optically transparent technologies). The optical backplane channels are created through the use of either imaging optics or 2D microlens arrays between the PCBs, as shown in Fig.…”

A 100 Mbps, LED Through-Wafer Optoelectronic Link for Multicomputer Interconnection Networks

“…By rethinking the network architecture, new techniques can be incorporated to allow dramatic improvements in overall interconnect performance. A three-dimensional optoelectronic network using hybrid integrated optoelectronic devices and through-wafer transmissions is currently being developed at Georgia Tech [26].…”

The offset cube: a three-dimensional multicomputer network topology using through-wafer optics

“…Such 3D packaging solutions improve signaling speed by minimizing the length of chip-to-chip signal paths and improve throughput by maximizing the number of interconnects crossing the network bisection. 3D packaging technologies also enable ultra-compact MPPs [33], [44], [52] for embedded applications by minimizing system volume and footprint.…”