Abstract:The fatigue life prediction of the electronic packages under dynamic loading conditions is an increasingly important area of research, with direct application in packaging industries. Current life prediction methodologies are, in general, developed through a finite element (FE) model that is correlated using an experimental data measured through sweep sine testing. The frequency response curve (FRF) generated by using a sweep sine testing may suffer from leakage and windowing of the signal may not work correct… Show more
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