A topological optimization procedure applied to multiple region problems with embedded sources

Abstract

The main objective of this work is the application of the topological optimization procedure to heat transfer problems considering multiple materials. The topological derivative (D T ) is employed for evaluating the domain sensitivity when perturbed by inserting a small inclusion. Electronic components such as printed circuit boards (PCBs) are an important area for the application of topological optimization. Generally, geometrical optimization involving heat transfer in PCBs considers only isotropic behaviour and/or a single material. Multiple domains with anisotropic characteristics take an important role on many industrial products, for instance when considering PCBs which are often connected to other components of different materials. In this sense, a methodology for solving topological optimization problems considering anisotropy and multiple regions with embedded heat sources is developed in this paper. A direct boundary element method (BEM) is employed for solving the proposed numerical problem.

A BEM model for heat flux exchange between particles and fluid

“…Every simulation had only one particle in the domain. The number of simulations has been ~10 5 . Each particle had a dimensionless heat source of magnitude = 10.…”

“…Fluid is most commonly modelled by the finite volume method, which is coupled with Lagrangian particle tracking and PIC for momentum/heat exchange. Our CFD solver uses the Boundary-Domain Integral Method BDIM [5], which has an unique advantage when handling point sources. In this paper, we will demonstrate how to use the BEM to derive a novel heat/momentum exchange model.…”