2013 Twenty-Eighth Annual IEEE Applied Power Electronics Conference and Exposition (APEC) 2013
DOI: 10.1109/apec.2013.6520520
|View full text |Cite
|
Sign up to set email alerts
|

A toroidal power inductor using radial-anisotropy thin-film magnetic material based on a hybrid fabrication process

Abstract: This paper presents improvements for the design and fabrication of high-frequency toroidal power inductors with and without radial-anisotropy thin-film magnetic material. An improved winding resistance model for toroids is developed considering an angle factor for actual winding shape, the effect of spacing between turns and loss associated with exterior current in the circumferential direction. A hybrid process for fabricating low-profile magnetic-core toroids is presented. The process uses standard flex prin… Show more

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
5

Citation Types

0
5
0

Year Published

2013
2013
2024
2024

Publication Types

Select...
3
3
1

Relationship

1
6

Authors

Journals

citations
Cited by 14 publications
(5 citation statements)
references
References 27 publications
0
5
0
Order By: Relevance
“…Detailed and accurate winding loss analysis are provided in [12], [13]. A winding configuration for reducing external flux, and capacitance is discussed in [14].…”
Section: Introductionmentioning
confidence: 99%
See 1 more Smart Citation
“…Detailed and accurate winding loss analysis are provided in [12], [13]. A winding configuration for reducing external flux, and capacitance is discussed in [14].…”
Section: Introductionmentioning
confidence: 99%
“…A winding configuration for reducing external flux, and capacitance is discussed in [14]. Coil fabrication technologies in a printed circuit board or with wafer-level integration have been developed in [13], [15]- [20]. Methods for developing radially anisotropic toroidal cores have been presented in [9], [10].…”
Section: Introductionmentioning
confidence: 99%
“…Embedding power converters into printed circuit board (PCB) substrates can be an efficient way to increase power density, improve modularity and reliability, simplify cooling, and decrease manufacturing costs [1,2]. In particular, various structures with PCB-based magnetic components have been studied such as 2D windings and 3D cores (e.g., racetrack, pot core) [3,4,5], 3D windings and 2D cores (e.g., toroid, meander) [6,7,8], or air-core components [9,10,11].…”
Section: Introductionmentioning
confidence: 99%
“…Many research papers have dealt with integrated and planar magnetic components, including coils, transformers and resonant circuits. These publications focused on manufacturing techniques [1,2,3,4], modelling [1,5], optimization [3], and simulation [1,6,7,8].…”
Section: Introductionmentioning
confidence: 99%
“…Various structures have been studied, planar [2,9], with solenoid-like structures (windings surrounding the magnetic corelike a toroid inductor) [1,4,10], with pot-core-like structures (core surrounding the windingslike with a PQcore) [3] or air-core components [6,7,8].…”
Section: Introductionmentioning
confidence: 99%