Recent advances in photocatalytic water splitting in
particulate
semiconductor systems have been tremendous in terms of efficiency
and scalable photoreactor design. In general, photocatalyst powders
are immersed in liquid water, leading to higher efficiency than gas-fed
water splitting systems. Conducting a gas-phase photocatalytic reaction
under water vapor, however, has several advantages versus liquid water,
such as easy scalability and suppression of leaching of the catalyst
components. Here, we offer a historical overview of photocatalytic
water splitting under vapor feeding. Moreover, the principles of water
adsorption are reviewed to understand the basic phenomena occurring
on the surface of semiconductor powders. The critical role of relative
humidity is identified, including water on the surface for ion conductivity,
which can close the electric circuit between cathodic and anodic reaction
sites. Finally, on the basis of the cross-sectional discussion of
reported works in both water vapor splitting and physical property
of the adsorbed water layer, how to develop the photocatalytic water
vapor splitting system and the perspective of the CO2 and
N2 reduction system using water vapor as an electron donor
are provided.