A triple-frequency transducer for endoscopic imaging: Simulation design and experimental verification

Li, Zhangjian; Xu, Jie; Zhu, Xi; Han, Zhile; Lv, Jiabing; Jian, Xiaohua; Shao, Weiwei; Jiao, Yang; Cui, Yaoping

doi:10.1016/j.sna.2021.112589

Cited by 12 publications

(1 citation statement)

References 26 publications

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“…In the proposed triple-element structure, the usable operating frequency can be extended while maintaining the advantages of the conventional back-to-back structure by adding a stack composed of a piezoelectric layer and a matching layer on the side of the back-to-back configuration. Also, three elements have a common backing layer and can be successfully integrated using split-assembling technique without additional support frame and isolation filler which were required in the previously conducted study [35]. Furthermore, the proposed triple-element transducer allows to perform image alignment or co-registration by simply rotating the other two images around the center image by −90 • and 90 • , respectively.…”

Section: Discussionmentioning

confidence: 99%

Triple-Element Back-to-Back Transducer With 3D Printed Housing for Intravascular Ultrasound Imaging: A Feasibility Study

Lee

Jeong

2022

IEEE Access

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Intravascular ultrasound (IVUS) can provide a high-resolution cross-sectional image of the blood vessel to detect the plaque morphology. The resolution of the IVUS image is proportional to a center frequency, however, a penetration depth decreases accordingly. To compensate for this problem, in this study, we propose the triple-element IVUS transducer capable of selecting an operating frequency according to the desired imaging area. In the proposed transducer, three-piezoelectric layers of 10 MHz, 20 MHz, and 30 MHz are formed on the top and both sides of the cube-shaped acoustic stack. These active layers share a common backing layer connected to one co-axial cable and can be driven simultaneously. In order to facilitate the manufacture process of the proposed IVUS transducer, split-assembling fabrication technique and a 3D printed housing with patterned electrodes were employed. The design specifications of the transducer were determined based on finite element analysis (FEA) simulation, and the prototype transducer was fabricated for feasibility study. The successful operation of individual elements constituting the proposed transducer was verified through B-mode imaging experiments using wire and tissue-mimicking phantoms. Subsequently, as a result of performing frequency compounding by combining two and three fundamental images, it was confirmed that the CNR (Contrast-to-Noise) value was improved by about 44%-77%. Therefore, the proposed IVUS transducer is expected to be one of the useful methods for diagnosing vascular diseases.INDEX TERMS Intravascular ultrasound transducer, triple-element acoustic stack, back-to-back configuration, 3D printed housing, frequency compounding.

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Section: Discussionmentioning

confidence: 99%