A two-dimensional computer simulation of capillarity-driven grain growth: Preliminary results

Frost, H. Robert; Thompson, Carl V.; Howe, Caitlin; Whang, Junho Peter

doi:10.1016/s0036-9748(88)80307-7

Cited by 193 publications

(77 citation statements)

References 15 publications

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“…Several computer simulations of two-dimensional grain growth have been reported in literature [56][57]. These simulation experiments all reveal a growth behaviour consistent with the expectations for two-dimensional normal grain growth.…”

Section: Normal and Abnormal Grain Growth In Thin Filmssupporting

confidence: 69%

“…In some cases, grooves can be formed where grain boundaries intersect the surfaces of the film due to the balance of the surface energies of neighbouring grains with the energy of the boundary between the grains [62][63]. The formation of these grooves can suppress or even pin grain boundaries and cause stagnation of grain growth for some subpopulations [9,56,62]. Sometimes, this can even lead to a complete grain growth stagnation.…”

Section: Normal and Abnormal Grain Growth In Thin Filmsmentioning

confidence: 99%

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Increasing the mean grain size in copper films and features

et al. 2008

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A new grain-growth mode is observed in thick sputtered copper films. This new grain-growth mode, also referred to in this work as super secondary grain growth (SSGG) leads to highly concentric grain growth with grain diameters of many tens of micrometers, and drives the system toward a {100} texture. The appearance, growth dynamics, final grain size, and self-annealing time of this new grain-growth mode strongly depends on the applied bias voltage during deposition of these sputtered films, the film thickness, the post-deposition annealing temperature, and the properties of the copper diffusion barrier layers used in this work. Moreover, a clear rivalry between this new growth mode and the regularly observed secondary grain-growth mode in sputtered copper films was found. The microstructure and texture evolution in these films is explained in terms of surface/interface energy and strain-energy density minimizing driving forces, where the latter seems to be an important driving force for the observed new growth mode. By combining these sputtered copper films with electrochemically deposited (ECD) copper films of different thickness, the SSGG growth mode could also be introduced in ECD copper, but this led to a reduced final SSGG grain size for thicker ECD films. The knowledge about the thin-film level is used to also implement this new growth mode in small copper features by slightly modifying the standard deposition process. It is shown that the SSGG growth mode can be introduced in narrow structures, but optimizations are still necessary to further increase the mean grain size in features.

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Section: Normal and Abnormal Grain Growth In Thin Filmssupporting

confidence: 69%

Section: Normal and Abnormal Grain Growth In Thin Filmsmentioning

confidence: 99%

Increasing the mean grain size in copper films and features

et al. 2008

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“…For example, Monte Carlo (MD) simulations based on the Potts model 5) are often used to study the grain growth kinetics. [6][7][8][9][10] Moreover, cellular automata (CA), [11][12][13][14] front tracking method, [15][16][17] level-set model, 18) vertex model, 19) surface-evolver model, 20) phasefield model [21][22][23][24][25][26][27] have been widely employed to discuss the grain growth kinetics from the mesoscale point of view. Especially, the multi-phase-field simulation 28,29) is a powerful tool to investigate microstructure evolution since it is not necessary to explicitly track the position of grain boundaries in the polycrystalline microstructure.…”

mentioning

confidence: 99%

Grain Growth in Large-Scale Molecular Dynamics Simulation: Linkage between Atomic Configuration and von Neumann-Mullins Relation

Okita

Shibuta

2016

ISIJ Int.

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“…There are different methods that are used for the modeling of the microstructure evolution, and among of them are the cellular automata (CA) models, 1) Monte Carlo Potts models, 2) the finite element method (FEM) based models, 3) the phase field models, 4,5) the front tracking method 6,7) and the vertex models.…”

Section: Introductionmentioning

confidence: 99%

Simulation of Microstructure Evolution during Shape Rolling with the Use of Frontal Cellular Automata

Svyetlichnyy

2012

ISIJ Int.

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The objective of the paper is an application of the model of the microstructure evolution based on three-dimensional cellular automata (CA) for hot shape rolling simulation. A short description of frontal cellular automata (FCA) is presented. The model contains two parts: the deformation and the microstructure evolution. The CA cells do not remain as undistorted cubes, but they are deformed according to the strain tensor. The independence of the grain growing from the shape and the sizes of the cell is ensured by the so-called "virtual front tracking". The microstructural part of the model simulates two phenomena: the nucleation and the growth of nuclei. There are three issues considered in the paper: the creation of the initial microstructure, the recrystallization and the phase transformation. When recrystallization is simulated, the nucleation and the grain boundary migration depend on the deformation parameters such as: the temperature, the strain, the strain rate, the dislocation density and the crystallographic orientation. The nucleation during the phase transformation is a function of the cooling rate and the final microstructure. These phenomena along with the deformation can be modeled over a wide range of multi-stage deformation processes. The process of shape rolling is chosen as an example. The data needed for the FCA calculations is received from the modeling by the finite element method. The results of the simulation of the microstructure evolution, during the last three passes of the round bars rolling with the consequent phase transformation, are presented in the paper.

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A two-dimensional computer simulation of capillarity-driven grain growth: Preliminary results

Cited by 193 publications

References 15 publications

Increasing the mean grain size in copper films and features

Increasing the mean grain size in copper films and features

Grain Growth in Large-Scale Molecular Dynamics Simulation: Linkage between Atomic Configuration and von Neumann-Mullins Relation

Simulation of Microstructure Evolution during Shape Rolling with the Use of Frontal Cellular Automata

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