2012 Twenty-Seventh Annual IEEE Applied Power Electronics Conference and Exposition (APEC) 2012
DOI: 10.1109/apec.2012.6166055
|View full text |Cite
|
Sign up to set email alerts
|

A unified silicon/silicon carbide IGBT model

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
1
1

Citation Types

0
9
0

Year Published

2012
2012
2021
2021

Publication Types

Select...
4
2

Relationship

1
5

Authors

Journals

citations
Cited by 16 publications
(9 citation statements)
references
References 7 publications
0
9
0
Order By: Relevance
“…where cjo is the zero-bias junction capacitance, and mj is the grading coefficient. agd is the gate-drain overlap area and ads is the body region area, where the sum of these areas is equal to the active area of the device a [1], [8]. This relationship is also indicated in Fig.…”
Section: A Mosfet Componentmentioning
confidence: 76%
See 3 more Smart Citations
“…where cjo is the zero-bias junction capacitance, and mj is the grading coefficient. agd is the gate-drain overlap area and ads is the body region area, where the sum of these areas is equal to the active area of the device a [1], [8]. This relationship is also indicated in Fig.…”
Section: A Mosfet Componentmentioning
confidence: 76%
“…This model covers the physics for both Si and SiC as well as n-and p-type devices. It builds on the contributions of past work in silicon in [8] and [12], and adds new contributions such as the modeling of SiC IGBT devices that were first reported in [1]. One key utility of the presented model comes from the fact that this model can be fit to any commercially available Si/SiC IGBT device as long as Fig.…”
mentioning
confidence: 98%
See 2 more Smart Citations
“…This has generally been because these solutions have been based on available tools and limited models which were not developed to take into account the particularities of the Avionic domain (huge and complex systems, multi-domain systems, multiple switching devices, and multiple networks. The other technique commonly used is to develop models for a specific region of operation such as power semiconductor compact models [15][16][17][18], [23].…”
Section: Key Challengesmentioning
confidence: 99%