2018
DOI: 10.1109/tmtt.2018.2854185
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A Universal Scalable Thermal Resistance Model for Compact Large-Signal Model of AlGaN/GaN HEMTs

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Cited by 36 publications
(18 citation statements)
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“…The bias-dependent source-and drain-resistance are utilized to obtain more accurate results. The thermal sub-circuit is used to compute the transient self-heating behavior [40].…”
Section: Large-signal Modelmentioning
confidence: 99%
“…The bias-dependent source-and drain-resistance are utilized to obtain more accurate results. The thermal sub-circuit is used to compute the transient self-heating behavior [40].…”
Section: Large-signal Modelmentioning
confidence: 99%
“…Le HEMT a été utilisé aussi dans plusieurs systèmes tels que les amplificateurs à haute puissance, les radars et les satellites, il se trouve aussi dans les capteurs et les dispositifs à radiofréquence [4]. En plus, la température de fonctionnement est un facteur très important, elle influence la fiabilité du HEMT, car la plupart de ses caractéristiques telle que la mobilité des électrons, la conductivité thermique, la vitesse de saturation et autres sont en fonction de la température [5]. Toutes ces caractéristiques ont tendance à se dégrader avec l'élévation de la température à cause de phénomène de l'auto-échauffement du transistor [6].…”
Section: Introductionunclassified
“…5 Great progress has been made in the development of GaN-on-diamond HEMTs, and more than three-fold increase in power density compared with GaN-on-SiC HEMTs has been demonstrated. [6][7][8] A wideband small signal equivalent circuit model (SSECM) is the foundation of large-signal modeling in the bottom-up method [9][10][11][12] and can also be used to build noise models 13 ; meanwhile, the small signal parameters can provide an essential feedback for device manufactures, which makes small signal modeling of great significance to the development and application of the device technology.…”
Section: Introductionmentioning
confidence: 99%