A user-friendly heat-resistant modified polymer-based adhesive for joining and repair of carbon/carbon composites

Wang, Mingchao; Hu, Xiaoxia; Xu, Xiqing; Yun, Ziqi; Liu, Jiachen; Du, Haiyan; Guo, Anran

doi:10.1016/j.matdes.2015.07.178

Cited by 15 publications

(5 citation statements)

References 12 publications

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“…Although joining methods for carbon materials have been studied extensively, very few papers have reported on the bonding of C/C composite parts using adhesives in recent years. [3][4][5] The adhesives for such applications must fulfil very stringent requirements, mainly concerning the overall stability of the structure under operative conditions.…”

Section: Introductionmentioning

confidence: 99%

Design, Realization, and Characterization of Advanced Adhesives for Joining Ultra‐Stable C/C Based Components

Casalegno

Ambrois

Corazzari

et al. 2020

Macro Materials & Eng

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The aim of this work is to develop high‐performance adhesives to join carbon fiber reinforced composites (C/C) for use in aerospace applications; in order to guarantee sound mechanical strength, a low coefficient of thermal expansion, and ease of application on large components. Several different adhesive formulations, based on phenolic or cyanate‐ester resins (charged with the maximum experimentally feasible amount of carbon‐based fillers), are developed and tested. The measurements of the lap shear strength at room temperature of the C/C joined by means of one phenolic and one cyanate ester‐based resin demonstrates that these formulations are the most suitable for the given application. A complete characterization, by means of viscosimetry, dilatometry, and thermal gravimetric analysis, coupled with gas analysis by means of mass spectroscopy, confirms that the phenolic‐based formulation is the most promising joining material. A nano‐indenter is used to obtain its Young modulus and hardness, both inside the joint and as a bulk cured adhesive.

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Section: Introductionmentioning

confidence: 99%

Design, Realization, and Characterization of Advanced Adhesives for Joining Ultra‐Stable C/C Based Components

Casalegno

Ambrois

Corazzari

et al. 2020

Macro Materials & Eng

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“…Therefore, it is necessary to find a new method for preparing an IEBP. Wang et al had reported on many carbon/carbon composites that were used as thermal structural materials in the aerospace, aviation, and industrial applications fields. These composite materials were obtained by binding the carbon materials with various adhesives, such as organic adhesives and phosphate adhesives, and then sintering them at a certain temperature in an argon or air atmosphere.…”

Section: Introductionmentioning

confidence: 99%

High‐temperature conductive binder for an integrated electrode bipolar plate and its application in vanadium redox flow battery

2019

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Summary A high‐temperature conductive binder for preparing an integrated electrode bipolar plate (IEBP) was proposed. The electrical resistance and stability of IEBP samples with different component proportions were tested after treated at different temperatures. The results showed that the mass ratio of phenolic resin, graphite powder, B4C, and SiO2 in the conductive binder was 1:0.5:0.5:0.1, and the IEBP prepared by it had the lowest electrical resistance and the highest stability in vanadium solution after treated at 800°C. The characterization results of thermogravimetry‐differential scanning calorimetry (TG‐DSC), X‐ray diffraction (XRD), Fourier transformed infrared radiation (FTIR), and scanning electron microscope (SEM) indicated that the bonding strength was closely related to the formation of borosilicate glass and the volume compensation from B4C's oxidation. The battery with IEBP had better performance than those with no binder, and it operated well at a current density up to 150 mA cm−2. Furthermore, the battery with IEBP had a stable cycling performance and the IEBP remained integrated after up to 100 charge‐discharge cycles.

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“…With the rapid development of aviation, energy, and metallurgy and the increased usage of large structure in harsh environments, such as high-temperature, high-pressure, and high-speed environments [ 1 , 2 , 3 , 4 , 5 , 6 , 7 ], people have increased their demand in the performance of materials, especially high temperature and ultrahigh-temperature adhesive materials. Inorganic phosphate adhesives are high temperature resistant materials based on the development of ceramic, cement, and refractory materials.…”

Section: Introductionmentioning

confidence: 99%

Effects of Nano-Aluminum Nitride on the Performance of an Ultrahigh-Temperature Inorganic Phosphate Adhesive Cured at Room Temperature

Chen

Wang

et al. 2017

Materials

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Based on the optimal proportion of resin and curing agent, an ultrahigh-temperature inorganic phosphate adhesive was prepared with aluminum dihydric phosphate, aluminium oxide (α-Al2O3), etc. and cured at room temperature (RT). Then, nano-aluminum nitride (nano-AlN), nano-Cupric oxide (nano-CuO), and nano-titanium oxide (nano-TiO2) were added into the adhesive. Differential scanning calorimetry was conducted using the inorganic phosphate adhesive to analyze the phosphate reactions during heat treatment, and it was found that 15 wt % nano-AlN could clearly decrease the curing temperature. Scanning electron microscopy was used to observe the microphenomenon of the modified adhesive at ultrahigh-temperature. The differential thermal analysis of the inorganic phosphate adhesive showed that the weight loss was approximately 6.5 wt % when the mass ratio of resin to curing agent was 1:1.5. An X-ray diffraction analysis of the adhesive with 10% nano-AlN showed that the phase structure changed from AlPO4(11-0500) to the more stable AlPO4(10-0423) structure after heat treatment. The shear strength of the adhesive containing 10% nano-AlN reached 7.3 MPa at RT due to the addition of nano-AlN, which promoted the formation of phosphate and increased the Al3+.

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A user-friendly heat-resistant modified polymer-based adhesive for joining and repair of carbon/carbon composites

Cited by 15 publications

References 12 publications

Design, Realization, and Characterization of Advanced Adhesives for Joining Ultra‐Stable C/C Based Components

Design, Realization, and Characterization of Advanced Adhesives for Joining Ultra‐Stable C/C Based Components

High‐temperature conductive binder for an integrated electrode bipolar plate and its application in vanadium redox flow battery

Effects of Nano-Aluminum Nitride on the Performance of an Ultrahigh-Temperature Inorganic Phosphate Adhesive Cured at Room Temperature

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